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DS1776E1/883

Texas Instruments

DS1776E1/883 by Texas Instruments

DS1776E1/883 by Texas Instruments is an 8-bit bus driver with a propagation delay of 22ns. It operates in a temperature range of -55 to 125°C, making it suitable for military applications. The chip carrier package style and open-collector output characteristics enhance its performance in various electronic systems.

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1k+

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Vyrian

USA . 4,973 parts In-Stock

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Digiode

USA . 4,504 parts In-Stock

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Northwest PG Solutions

USA . 2,071 parts In-Stock

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$2.742

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$2.742

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AZTECH Wire

Italy . 252 parts In-Stock

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$15.674

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Parana Technologies

USA . 1,821 parts In-Stock

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$26.776

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$28.469

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DigiPath Technology Company

USA . 422 parts In-Stock

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$29.483

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$27.125

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ChromeModa Solutions

Germany . 2,675 parts In-Stock

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$30.085

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$24.670

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IDEA Electronic Components Group

UK . 1,932 parts In-Stock

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$30.085

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$28.581

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$27.076

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One Stop Electronics

USA . 1,135 parts In-Stock

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Component Stockers USA

USA . 578 parts In-Stock

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$99.990

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Corphita

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Native Components

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Overview

Discover the DS1776E1/883 by Texas Instruments, a high-quality Bus Driver & Transceiver designed to meet MIL-STD-883 standards. With its ceramic, metal-sealed co-fired package body material and advanced BICMOS technology, this chip carrier offers superior performance in harsh environments. Whether used in military applications or industrial settings, the DS1776E1/883 delivers reliable operation, true output polarity, and fast propagation delay of only 22ns. Trust Texas Instruments for innovative solutions that provide value and peace of mind for your projects.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material ensures durability and reliability, making the product suitable for harsh environments.

Surface Mount: YES

Makes installation easier and more efficient, especially in modern electronic circuit designs.

Screening Level: MIL-STD-883

Complies with military standards for reliability and performance, ensuring high quality.

No. of Bits: 8

Provides sufficient data handling capabilities for various applications.

Nominal Supply Voltage / Vsup (V): 5

Standard supply voltage for compatibility with other components.

No. of Terminals: 28

Offers flexibility in connecting to other devices or components in a circuit.

Package Style (Meter): CHIP CARRIER

Compact design for space-saving and efficient PCB layout.

Propagation Delay (tpd): 22 ns

Fast signal propagation for quick data transmission.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, suitable for industrial applications.

Output Characteristics: OPEN-COLLECTOR/3-STATE

Flexible output options for different circuit configurations.

Minimum Operating Temperature: -55 °C

Capable of operating in extreme cold conditions without performance loss.

Terminal Position: QUAD

Easy identification and connection of terminals for efficient installation.

No. of Ports: 2

Sufficient ports for interfacing with external devices or systems.

Maximum Seated Height: 2.03 mm

Low-profile design for compact electronic devices.

Width: 11.43 mm

Compact width for efficient PCB layout and space utilization.

Output Polarity: TRUE

Clear and reliable signal polarity for accurate data transmission.

Minimum Supply Voltage (Vsup): 4.5 V

Can operate at lower voltages for energy-efficient applications.

Length: 11.43 mm

Compact length for space-saving in electronic designs.

Temperature Grade: MILITARY

Meets high standards for temperature range and durability required in military applications.

Technology: BICMOS

Combines benefits of both bipolar and CMOS technologies for improved performance and efficiency.

Terminal Form: NO LEAD

Lead-free terminals for environmental friendliness and compliance with regulations.

Terminal Pitch: 1.27 mm

Standard terminal pitch for compatibility with various PCB designs.

Maximum Supply Voltage (Vsup): 5.5 V

Provides an upper limit for safe voltage operation, ensuring device longevity and protection.

Technical Specifications

Bus Driver & Transceivers DS1776E1/883 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

BTL PORT WITH STANDARD INPUTS AND OPEN COLLECTOR OUTPUTS

Family:

F/FAST

JESD-30 Code:

S-CQCC-N28

Length:

11.43 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

28

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

OPEN-COLLECTOR/3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Propagation Delay (tpd):

22 ns

Screening Level:

MIL-STD-883

Maximum Seated Height:

2.03 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.43 mm

Trade Compliance

DS1776E1/883 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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