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DS160PR410RNQR

Texas Instruments

DS160PR410RNQR by Texas Instruments

DS160PR410RNQR by Texas Instruments is a Line Transceiver with 4 channels, operating at industrial temperature grade. It features differential input characteristics and offers a max supply voltage of 3.6V. With a package style of CHIP CARRIER, it is suitable for applications requiring high-speed data transmission in compact spaces.

Median Price

$6.072

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 11,179 parts In-Stock

1+ parts

$6.072

100+ parts

$4.950

1k+ parts

$3.300

10k+ parts

-

11,179

$6.072

$4.950

$3.300

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$4.400

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$4.400

-

-

-

Digiode

USA . 547 parts In-Stock

1+ parts

$5.768

100+ parts

-

1k+ parts

-

10k+ parts

-

547

$5.768

-

-

-

Chip Stock

USA . 11,500 parts In-Stock

1+ parts

-

100+ parts

-

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11,500

-

-

-

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Vyrian

USA . 8,479 parts In-Stock

1+ parts

-

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-

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-

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8,479

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,112 parts In-Stock

1+ parts

$3.891

100+ parts

-

1k+ parts

$4.369

10k+ parts

-

2,112

$3.891

-

$4.369

-

DigiPath Technology Company

USA . 1,375 parts In-Stock

1+ parts

$4.285

100+ parts

-

1k+ parts

-

10k+ parts

-

1,375

$4.285

-

-

-

ChromeModa Solutions

Germany . 3,229 parts In-Stock

1+ parts

$4.372

100+ parts

$3.585

1k+ parts

-

10k+ parts

-

3,229

$4.372

$3.585

-

-

IDEA Electronic Components Group

UK . 1,003 parts In-Stock

1+ parts

$4.372

100+ parts

-

1k+ parts

$3.935

10k+ parts

-

1,003

$4.372

-

$3.935

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Continental Prestige Electronics

USA . 4,003 parts In-Stock

1+ parts

$4.400

100+ parts

-

1k+ parts

-

10k+ parts

$4.312

4,003

$4.400

-

-

$4.312

Netroflash

USA . 500 parts In-Stock

1+ parts

$4.400

100+ parts

-

1k+ parts

-

10k+ parts

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500

$4.400

-

-

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Argo Parts USA

USA . 299 parts In-Stock

1+ parts

$4.400

100+ parts

-

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299

$4.400

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Ampacity Inc.

Singapore . 11,072 parts In-Stock

1+ parts

$5.160

100+ parts

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11,072

$5.160

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Corphita

USA . 3,106 parts In-Stock

1+ parts

$5.465

100+ parts

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3,106

$5.465

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Corohmni

South Africa . 379 parts In-Stock

1+ parts

$9.630

100+ parts

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379

$9.630

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AZTECH Wire

Italy . 234 parts In-Stock

1+ parts

$21.170

100+ parts

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234

$21.170

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Lixinc

USA . 9,366 parts In-Stock

1+ parts

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9,366

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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3,500

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Overview

Experience the superior quality and reliability of Texas Instruments with the DS160PR410RNQR, a cutting-edge line driver and receiver. Perfect for industrial applications, this product offers unparalleled performance and precision, with 4 functions in a compact chip carrier package. With a wide operating temperature range and differential output, this line transceiver ensures optimal signal transmission. Trust Texas Instruments for innovative solutions that deliver exceptional value and benefits to customers seeking high-quality components for their projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protects the internal components from external damage.

Surface Mount: YES

Allows for easy and secure mounting on circuit boards.

Maximum Supply Voltage: 3.6 V

Supports a wide range of input voltages, making it versatile for different applications.

No. of Functions: 4

Offers multiple functionalities in a single package, saving space and simplifying circuit design.

Package Shape: RECTANGULAR

Facilitates easy placement and integration into electronic systems.

Maximum Transmit Delay: 0.13 ns

Ensures fast data transmission and low latency in communication networks.

No. of Terminals: 40

Provides ample connection points for interfacing with other components or devices.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Offers efficient heat dissipation and compact form factor for space-constrained applications.

Minimum Supply Voltage: 3 V

Operates reliably even at low input voltages, ensuring consistent performance.

Maximum Operating Temperature: 85 °C

Withstands high operating temperatures, suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Maintains functionality even in extreme cold conditions, providing reliability in various environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Corrosion-resistant finish for long-term reliability and signal integrity.

Terminal Position: QUAD

Facilitates easy and secure connections in a quad arrangement.

Maximum Seated Height: 0.8 mm

Low-profile design for compact and space-efficient installations.

Width: 4 mm

Compact width for efficient use of board space.

Receiver No. of Bits: 4

Allows for precise data reception and processing of 4-bit signals.

Differential Output: YES

Delivers differential signals for noise immunity and improved signal integrity.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering and reflow process during PCB assembly.

Peak Reflow Temperature °C: 260

Meets industry-standard reflow temperatures for reliable solder joints.

Length: 6 mm

Optimal length for easy handling and integration into electronic systems.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications requiring robust performance in challenging environments.

Maximum Receive Delay: 0.13 ns

Ensures fast and accurate reception of data with minimal delay.

No. of Channels: 4

Supports communication across four channels for versatile connectivity.

Terminal Form: NO LEAD

Lead-free terminal form for compliance with environmental regulations and RoHS directives.

Input Characteristics: DIFFERENTIAL

Accepts differential input signals for noise rejection and improved signal fidelity.

Nominal Supply Voltage: 3.3 V

Compatible with common supply voltages for seamless integration into existing systems.

Terminal Pitch: 0.4 mm

Fine terminal pitch for high-density mounting and compact circuit layouts.

Driver No. of Bits: 4

Delivers precise 4-bit data transmission for accurate communication between devices.

Interface IC Type: LINE TRANSCEIVER

Facilitates bidirectional data transfer between different communication lines or networks.

Technical Specifications

Line Drivers & Receivers DS160PR410RNQR attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

4

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

4

No. of Functions:

4

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Receive Delay:

.13 ns

Receiver No. of Bits:

4

Maximum Seated Height:

.8 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

.13 ns

Width:

4 mm

Trade Compliance

DS160PR410RNQR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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