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DS160PR1601ZDGR

Texas Instruments

DS160PR1601ZDGR by Texas Instruments

DS160PR1601ZDGR by Texas Instruments is a Line Driver & Receiver with 32 channels. It operates at 3-3.6V, -40 to 85°C, and has a 0.17ns transmit/receive delay. Ideal for applications requiring differential input/output characteristics in compact PCB designs.

Median Price

$33.178

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 4,253 parts In-Stock

1+ parts

$30.600

100+ parts

$27.200

1k+ parts

$20.000

10k+ parts

-

4,253

$30.600

$27.200

$20.000

-

DigiKey

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$35.757

10k+ parts

-

1,000

-

-

$35.757

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 235 parts In-Stock

1+ parts

$29.070

100+ parts

-

1k+ parts

-

10k+ parts

-

235

$29.070

-

-

-

Vyrian

USA . 2,237 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,237

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 17 parts In-Stock

1+ parts

$5.950

100+ parts

-

1k+ parts

-

10k+ parts

-

17

$5.950

-

-

-

Semicontronic

India . 2,427 parts In-Stock

1+ parts

$26.010

100+ parts

$25.360

1k+ parts

$25.230

10k+ parts

-

2,427

$26.010

$25.360

$25.230

-

Corphita

USA . 1,948 parts In-Stock

1+ parts

$27.540

100+ parts

-

1k+ parts

-

10k+ parts

-

1,948

$27.540

-

-

-

Corohmni

South Africa . 496 parts In-Stock

1+ parts

$30.600

100+ parts

-

1k+ parts

-

10k+ parts

-

496

$30.600

-

-

-

Northwest PG Solutions

USA . 2,360 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$5.831

10k+ parts

-

2,360

-

-

$5.831

-

Overview

Experience seamless communication with the DS160PR1601ZDGR by Texas Instruments, a top-of-the-line Line Driver & Receiver that guarantees exceptional quality and reliability. Manufactured by industry leader Texas Instruments, this product offers unmatched performance and versatility for a wide range of applications. With its advanced features and cutting-edge technology, the DS160PR1601ZDGR provides customers with unparalleled value, benefits, and advantages. Upgrade your communication systems today with this innovative solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the electronic components within the package.

Surface Mount: YES

Makes it easier to integrate into circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, making it versatile for different applications.

No. of Functions: 32

Offers a high level of functionality for complex electronic systems.

Maximum Transmit Delay: 0.17 ns

Ensures fast transmission of signals, critical for high-speed communication.

Technical Specifications

Line Drivers & Receivers DS160PR1601ZDGR attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

32

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

JESD-30 Code:

R-PBGA-B354

JESD-609 Code:

e1

Length:

22.8 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

32

No. of Functions:

32

No. of Terminals:

354

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-DRAIN

Maximum Output Low Current:

-4 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA354,35X42,24

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Receive Delay:

.17 ns

Receiver No. of Bits:

32

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.6 mm

Terminal Position:

BOTTOM

Maximum Transmit Delay:

.17 ns

Width:

22.8 mm

Trade Compliance

DS160PR1601ZDGR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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