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DS1692J

Texas Instruments

DS1692J by Texas Instruments

DS1692J by Texas Instruments is a LINE DRIVER with 2 functions, operating at -55 to 125 °C. It has a max supply voltage of 5.5 V and max transmit delay of 300 ns. Ideal for MILITARY applications requiring high-speed signal transmission in harsh environments.

Median Price

$24.010

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

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American Microsemiconductor Inc.

USA . 43 parts In-Stock

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Vyrian

USA . 4,673 parts In-Stock

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Anansix

USA . 2,371 parts In-Stock

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Digiode

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PC Components Company LLC

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Bristol Electronics

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QIE Inc.

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Electronic Expediters

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Beltway Electronics Company

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Elcom Components

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MISTER SPROCKETS

USA . 1 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 1,602 parts In-Stock

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$2.244

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$208.361

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$2.019

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DigiPath Technology Company

USA . 854 parts In-Stock

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$2.471

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$2.273

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$2.471

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ChromeModa Solutions

Germany . 3,576 parts In-Stock

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$2.521

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$2.067

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IDEA Electronic Components Group

UK . 1,390 parts In-Stock

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$2.269

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One Stop Electronics

USA . 163 parts In-Stock

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$6.500

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AZTECH Wire

Italy . 645 parts In-Stock

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Native Components

USA . 282 parts In-Stock

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Semicontronic

India . 887 parts In-Stock

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$12.188

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Northwest PG Solutions

USA . 839 parts In-Stock

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$13.519

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Corphita

USA . 4,380 parts In-Stock

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Kepictronics

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Overview

Experience top-notch performance with the DS1692J by Texas Instruments, a leading manufacturer in the industry. This line driver and receiver offers unparalleled quality and reliability for your applications. With its advanced features and functionality, this product delivers exceptional value and benefits to customers. Trust in Texas Instruments to provide you with cutting-edge technology that will elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages provide excellent thermal conductivity and mechanical stability, ensuring reliable performance in a wide range of operating conditions.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this product can be used in various applications without the risk of voltage overload.

No. of Functions: 2

Having multiple functions in a single device reduces the need for additional components, simplifying the overall system design and reducing cost.

Package Shape: RECTANGULAR

Rectangular packages are easy to handle, mount, and integrate into circuit designs, making them user-friendly for both assembly and maintenance.

Maximum Transmit Delay: 300 ns

Low transmit delay ensures quick signal transmission, making this product suitable for high-speed communication applications.

No. of Terminals: 16

Having a higher number of terminals allows for more connectivity options, enabling flexibility in circuit configurations and signal routing.

Maximum High Level Input Current: 0.0001 Amp

Low input current requirements reduce power consumption and minimize the risk of damage from overcurrent conditions.

Minimum Supply Voltage: 4.5 V

Having a low minimum supply voltage ensures compatibility with a wide range of power sources, making this product versatile in different environments.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature ensures reliable performance in harsh environments with elevated temperature conditions.

Output Characteristics: 3-STATE

3-state outputs provide flexibility in driving signals, allowing for tri-state operation and convenient signal control.

Minimum Operating Temperature: -55 °C

With a low minimum operating temperature, this product can reliably function in cold temperature environments without performance degradation.

Terminal Position: DUAL

Dual terminal positions provide redundancy and increased reliability in signal connections, reducing the risk of signal loss or disconnection.

Maximum Seated Height: 5.08 mm

A low seated height allows for compact and space-efficient PCB layouts, making this product suitable for applications with limited installation space.

Width: 7.62 mm

Compact width dimensions enable efficient component placement on a PCB, optimizing circuit layout and minimizing signal interference.

Maximum Output Low Current: 0.15 Amp

High output current capabilities ensure efficient driving of external loads, making this product suitable for applications requiring robust signal transmission.

Output Polarity: TRUE

True output polarity ensures accurate signal representation, preventing signal distortion and ensuring reliable data communication.

Length: 19.94 mm

Optimal length dimensions provide a good balance between compactness and functionality, making this product suitable for various space-constrained applications.

Temperature Grade: MILITARY

Military-grade temperature specifications ensure reliable operation in extreme temperature environments, making this product suitable for rugged and demanding applications.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure and reliable connections to the PCB, ensuring stable signal transmission and robust mechanical attachment.

Interface Standard: MIL-STD-188-114A

Compliance with a standard interface specification ensures interoperability and compatibility with a wide range of systems and devices, enhancing overall system integration.

Input Characteristics: GATED

Gated input characteristics enable precise control over signal input, allowing for tailored signal processing and efficient signal manipulation.

Nominal Supply Voltage: 5 V

Having a nominal supply voltage of 5V ensures compatibility with standard power sources, simplifying system design and integration.

Nominal Negative Supply Voltage: -5 V

Support for a negative supply voltage enables bidirectional signal transmission and provides flexibility in signal handling, making this product versatile in various applications.

Terminal Pitch: 2.54 mm

Standard terminal pitch allows for easy integration into a wide range of PCB layouts, ensuring compatibility with standard PCB design guidelines and practices.

Driver No. of Bits: 2

With a 2-bit driver, this product can handle a range of binary signal inputs, providing flexibility and versatility in signal processing and transmission.

Interface IC Type: LINE DRIVER

As a line driver, this product is designed to provide robust signal amplification and transmission capabilities, making it ideal for driving signals over long distances or in noisy environments.

Technical Specifications

Line Drivers & Receivers DS1692J attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Driver No. of Bits:

2

Maximum High Level Input Current:

.0001 Amp

Input Characteristics:

GATED

Interface IC Type:

Interface Standard:

MIL-STD-188-114A

JESD-30 Code:

R-GDIP-T16

Length:

19.94 mm

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Maximum Output Low Current:

.15 Amp

Output Polarity:

TRUE

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

300 ns

Width:

7.62 mm

Trade Compliance

DS1692J Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-157-2622, 5962011572622

NIIN

011572622

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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