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DS16F95AJA

Texas Instruments

DS16F95AJA by Texas Instruments

DS16F95AJA by Texas Instruments is a line driver with 5.5V max supply voltage, 50ns max transmit delay, and 180°C max operating temp. Ideal for EIA-422-B, TIA-422-B, EIA-485-A, and TIA-485-A interfaces in military-grade applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,979 parts In-Stock

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Digiode

USA . 2,902 parts In-Stock

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Anansix

USA . 2,654 parts In-Stock

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Native Components

USA . 978 parts In-Stock

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$0.523

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Northwest PG Solutions

USA . 1,903 parts In-Stock

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$0.576

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Parana Technologies

USA . 1,783 parts In-Stock

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$10.538

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$11.044

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$10.538

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IDEA Electronic Components Group

UK . 1,390 parts In-Stock

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$11.840

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$11.248

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$10.656

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$11.840

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ChromeModa Solutions

Germany . 523 parts In-Stock

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$11.840

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$9.709

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AZTECH Wire

Italy . 658 parts In-Stock

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$15.511

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One Stop Electronics

USA . 468 parts In-Stock

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$43.500

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Alle Elektronik GmbH

Germany . 4,111 parts In-Stock

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Authorized Procurement Solutions

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Microchip USA

USA . 2,681 parts In-Stock

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Corphita

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DigiPath Technology Company

USA . 2,199 parts In-Stock

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Perfect Parts

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Kepictronics

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Overview

Unlock unparalleled performance with the DS16F95AJA by Texas Instruments. Crafted with precision in a ceramic, glass-sealed package, this line driver & receiver offers lightning-fast transmission speeds and robust reliability. Ideal for military-grade applications, this bipolar technology interface IC transcends expectations with differential output and dual-terminal position. With a maximum transmit delay of just 50 ns and a temperature range from -55°C to 180°C, the DS16F95AJA delivers unrivaled quality and value that will elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection for the internal components, ensuring reliability in various environmental conditions.

Maximum Supply Voltage: 5.5 V

Supports a wide range of supply voltages, offering flexibility in system design.

Package Shape: RECTANGULAR

Convenient shape for easy integration into circuit designs and PCB layouts.

Maximum Transmit Delay: 50 ns

Offers fast transmission speeds, suitable for high-speed data communication applications.

Power Supplies (V): 5

Operates efficiently at a standard voltage level commonly used in electronics.

No. of Terminals: 8

Provides multiple connection points for interfacing with other components in the system.

Temperature Grade: MILITARY

Designed to meet stringent military-grade standards for reliability and performance in harsh environments.

Interface Standard: EIA-422-B; TIA-422-B; EIA-485-A; TIA-485-A

Complies with industry standards for communication protocols, ensuring compatibility with a wide range of devices.

Input Characteristics: DIFFERENTIAL SCHMITT TRIGGER

Provides stable and reliable signal conditioning for accurate data transmission.

Technical Specifications

Line Drivers & Receivers DS16F95AJA attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.00002 Amp

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-422-B; TIA-422-B; EIA-485-A; TIA-485-A

JESD-30 Code:

R-GDIP-T8

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

180 Cel

Minimum Operating Temperature:

-55 Cel

Minimum Out Swing:

1.5 V

Maximum Output Low Current:

16 Amp

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

50 ns

Receiver No. of Bits:

1

Maximum Seated Height:

5.08 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

28 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

50 ns

Width:

7.62 mm

Trade Compliance

DS16F95AJA Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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