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DS1603J

Texas Instruments

DS1603J by Texas Instruments

DS1603J by Texas Instruments is a LINE RECEIVER with 14 terminals, operating at -55 to 125 °C. It has a supply voltage range of 4.5-5.5 V and max receive delay of 25 ns. Ideal for military-grade applications requiring differential input characteristics in an IN-LINE package style.

Median Price

$120.000

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

American Microsemiconductor Inc.

USA . 4 parts In-Stock

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$120.000

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4

$120.000

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Vyrian

USA . 4,877 parts In-Stock

1+ parts

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4,877

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Digiode

USA . 3,904 parts In-Stock

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3,904

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Anansix

USA . 2,000 parts In-Stock

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2,000

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Q Components

USA . 5 parts In-Stock

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5

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 629 parts In-Stock

1+ parts

$5.098

100+ parts

-

1k+ parts

$5.680

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629

$5.098

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$5.680

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DigiPath Technology Company

USA . 2,181 parts In-Stock

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$5.613

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2,181

$5.613

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ChromeModa Solutions

Germany . 6,040 parts In-Stock

1+ parts

$5.728

100+ parts

$4.697

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6,040

$5.728

$4.697

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IDEA Electronic Components Group

UK . 2,302 parts In-Stock

1+ parts

$5.728

100+ parts

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$5.155

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2,302

$5.728

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$5.155

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AZTECH Wire

Italy . 601 parts In-Stock

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$15.697

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601

$15.697

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Native Components

USA . 34 parts In-Stock

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$22.279

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34

$22.279

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Northwest PG Solutions

USA . 1,800 parts In-Stock

1+ parts

$24.507

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$22.056

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1,800

$24.507

$22.056

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One Stop Electronics

USA . 815 parts In-Stock

1+ parts

$47.500

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815

$47.500

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Corphita

USA . 2,765 parts In-Stock

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2,765

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Perfect Parts

USA . 2,455 parts In-Stock

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2,455

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Overview

Experience superior quality and reliability with the DS1603J line driver & receiver from Texas Instruments. This versatile component offers unmatched performance in a wide range of applications, thanks to its advanced technology and military-grade construction. With a nominal supply voltage of 5V and maximum operating temperature of 125°C, this product provides exceptional value and benefits to customers seeking dependable solutions for their electronic projects. Trust Texas Instruments to deliver the quality and innovation you need for your next design challenge.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The use of ceramic and glass-sealed material ensures durability and reliability, making this product resistant to environmental factors such as moisture and temperature variations.

Maximum Supply Voltage: 5.5 V

Allows for a higher supply voltage which increases the versatility and compatibility of the product with various systems and applications.

Package Shape: RECTANGULAR

The rectangular shape of the package provides a compact form factor, saving space and making it easier to integrate into different designs.

Maximum Operating Temperature: 125 °C

Capable of operating at high temperatures, making it suitable for demanding industrial and military applications that require reliable performance in extreme conditions.

Technology: BIPOLAR

Bipolar technology offers high speed and low noise performance, making it ideal for applications that require precise signal transmission and reception.

Technical Specifications

Line Drivers & Receivers DS1603J attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

PLUS 3V AND -3V INPUT COMMON MODE VOLTAGE

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

JESD-30 Code:

R-GDIP-T14

Length:

19.939 mm

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Maximum Receive Delay:

25 ns

Receiver No. of Bits:

2

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

DS1603J Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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