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DRV102FKTWTG3

Texas Instruments

DRV102FKTWTG3 by Texas Instruments

DRV102FKTWTG3 by Texas Instruments is a peripheral driver with a max supply voltage of 60V and built-in protections for over current and thermal issues. It operates b/w -55 to 125°C, making it suitable for military-grade applications. With a nominal output peak current limit of 2.7A, this buffer or inverter-based driver is ideal for driving various loads in electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,243 parts In-Stock

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Digiode

USA . 3,041 parts In-Stock

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3,041

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Nova Conductors

Japan . 18 parts In-Stock

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18

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Distributors (Availability)

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Parana Technologies

USA . 706 parts In-Stock

1+ parts

$2.963

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$3.463

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706

$2.963

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$3.463

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DigiPath Technology Company

USA . 1,533 parts In-Stock

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$3.262

100+ parts

$3.001

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$3.262

$3.001

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ChromeModa Solutions

Germany . 3,782 parts In-Stock

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$3.329

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$2.730

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$3.329

$2.730

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IDEA Electronic Components Group

UK . 670 parts In-Stock

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$3.329

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$2.996

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670

$3.329

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$2.996

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AZTECH Wire

Italy . 734 parts In-Stock

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$6.408

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734

$6.408

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Corohmni

South Africa . 594 parts In-Stock

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$8.411

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$8.411

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Ampacity Inc.

Singapore . 1,468 parts In-Stock

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$10.500

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$10.500

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One Stop Electronics

USA . 1,613 parts In-Stock

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$33.500

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Continental Prestige Electronics

USA . 6,722 parts In-Stock

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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Corphita

USA . 1,974 parts In-Stock

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Argo Parts USA

USA . 1,489 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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Microchip USA

USA . 229 parts In-Stock

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Perfect Parts

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Overview

Enhance your electronic designs with the DRV102FKTWTG3 by Texas Instruments, a top-tier manufacturer known for quality and reliability. This peripheral driver offers over current and thermal protections, ensuring safety and durability. Ideal for a wide range of applications, this product delivers a maximum output current of 1A and operates with a supply voltage range of 8V to 24V. Upgrade your projects with this versatile and efficient component that provides excellent value and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides a durable and lightweight package for the peripheral driver, making it easy to handle and install.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 60 V

The high maximum supply voltage of 60V ensures compatibility with a wide range of power sources, making the peripheral driver versatile and suitable for different applications.

Built-in Protections: OVER CURRENT; THERMAL

The built-in protections against over current and thermal issues ensure the safety and reliability of the peripheral driver, safeguarding connected devices from damage.

Power Supplies (V): 24

The 24V power supply allows for consistent and reliable operation of the peripheral driver, ensuring stable performance in various electrical systems.

Maximum Output Current: 1 A

With a maximum output current of 1A, this peripheral driver is capable of driving various components and devices within its specified limits, offering flexibility in design and functionality.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures that the peripheral driver can function effectively in a wide range of environmental conditions, making it suitable for industrial settings.

Technical Specifications

Peripheral Drivers DRV102FKTWTG3 attributes and parameters. Explore more Peripheral Drivers devices from Texas Instruments

Specs

Built-in Protections:

OVER CURRENT; THERMAL

Driver No. of Bits:

1

JESD-30 Code:

R-PSSO-G7

JESD-609 Code:

e3

Length:

10.095 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

7

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Current Flow Direction:

SOURCE

Maximum Output Current:

1 A

Nominal Output Peak Current Limit:

2.7 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SMSIP7H,.55,50TB

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Power Supplies (V):

24

Qualification:

Not Qualified

Maximum Seated Height:

4.955 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

60 V

Minimum Supply Voltage:

8 V

Nominal Supply Voltage:

24 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Width:

8.89 mm

Trade Compliance

DRV102FKTWTG3 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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