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DRV102TG3

Texas Instruments

DRV102TG3 by Texas Instruments

DRV102TG3 by Texas Instruments is a peripheral driver with a max supply voltage of 60V and built-in protections for over current and thermal issues. It operates b/w -55 to 125°C, suitable for military-grade applications. With a nominal output peak current limit of 2.7A, it is ideal for buffer or inverter-based systems requiring a source flow direction.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,579 parts In-Stock

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3,579

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Digiode

USA . 1,759 parts In-Stock

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1,759

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,152 parts In-Stock

1+ parts

$12.007

100+ parts

-

1k+ parts

$12.412

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1,152

$12.007

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$12.412

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AZTECH Wire

Italy . 617 parts In-Stock

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$12.314

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617

$12.314

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DigiPath Technology Company

USA . 203 parts In-Stock

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$13.221

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$12.163

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203

$13.221

$12.163

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ChromeModa Solutions

Germany . 4,512 parts In-Stock

1+ parts

$13.491

100+ parts

$11.063

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4,512

$13.491

$11.063

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IDEA Electronic Components Group

UK . 1,404 parts In-Stock

1+ parts

$13.491

100+ parts

$12.816

1k+ parts

$12.142

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1,404

$13.491

$12.816

$12.142

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One Stop Electronics

USA . 351 parts In-Stock

1+ parts

$15.500

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351

$15.500

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Ampacity Inc.

Singapore . 1,189 parts In-Stock

1+ parts

$36.500

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1,189

$36.500

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Continental Prestige Electronics

USA . 5,040 parts In-Stock

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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Argo Parts USA

USA . 3,061 parts In-Stock

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3,061

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Corphita

USA . 1,253 parts In-Stock

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Bastille Electronics

Australia . 500 parts In-Stock

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500

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Microchip USA

USA . 260 parts In-Stock

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260

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Overview

Enhance your electronic designs with the DRV102TG3 by Texas Instruments, a top-tier manufacturer known for quality and reliability. This peripheral driver offers overcurrent and thermal protections, ensuring seamless operation in diverse applications. From industrial automation to automotive systems, this versatile device provides superior performance with up to 1A output current and a wide supply voltage range. Upgrade your projects with the DRV102TG3 and experience unparalleled value and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material ensures durability and reliability for long-term use.

Maximum Supply Voltage: 60 V

With a high maximum supply voltage of 60V, this peripheral driver can handle a wide range of power sources.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into various types of electronic devices.

Built-in Protections: OVER CURRENT; THERMAL

The inclusion of over current and thermal protections helps to prevent damage to connected devices and ensures safe operation.

Power Supplies (V): 24

Operating at a power supply of 24V makes this peripheral driver suitable for a variety of industrial applications.

No. of Terminals: 7

The seven terminals provide ample connection points for interfacing with other components.

Package Style (Meter): FLANGE MOUNT

The flange mount package style offers a secure and stable mounting solution for the peripheral driver.

Minimum Supply Voltage: 8 V

With a low minimum supply voltage of 8V, this driver can still function effectively in lower power environments.

Maximum Operating Temperature: 125 °C

Able to withstand temperatures up to 125°C, this peripheral driver is suitable for high-temperature environments.

Minimum Operating Temperature: -55 °C

With a minimum operating temperature of -55°C, this driver can also function in extremely cold conditions.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides excellent conductivity and corrosion resistance for long-lasting performance.

Terminal Position: ZIG-ZAG

The zig-zag terminal position allows for efficient and easy wiring connections.

Temperature Grade: MILITARY

Designed to meet military-grade standards, this peripheral driver is highly reliable and durable.

Maximum Output Current: 1 A

With a maximum output current of 1A, this driver can effectively drive various peripherals.

Technology: BIPOLAR

The bipolar technology used in this driver enables precise control and efficient operation.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides a secure and stable connection for various components.

Nominal Supply Voltage: 24 V

Operating at a nominal supply voltage of 24V ensures compatibility with standard power sources.

Terminal Pitch: 1.27 mm

The 1.27mm terminal pitch allows for easy integration into existing circuitry with standard spacing.

Nominal Output Peak Current Limit: 2.7 A

The 2.7A nominal output peak current limit provides sufficient power for driving peripherals.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The interface IC type allows for flexible integration into different types of electronic systems.

Output Current Flow Direction: SOURCE

The source output current flow direction ensures compatibility with a wide range of devices.

Technical Specifications

Peripheral Drivers DRV102TG3 attributes and parameters. Explore more Peripheral Drivers devices from Texas Instruments

Specs

Built-in Protections:

OVER CURRENT; THERMAL

Driver No. of Bits:

1

JESD-30 Code:

R-PZFM-T7

JESD-609 Code:

e3

No. of Functions:

1

No. of Terminals:

7

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Current Flow Direction:

SOURCE

Maximum Output Current:

1 A

Nominal Output Peak Current Limit:

2.7 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

ZFM

Package Equivalence Code:

ZIP7,.15,.2TB

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Power Supplies (V):

24

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

60 V

Minimum Supply Voltage:

8 V

Nominal Supply Voltage:

24 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

ZIG-ZAG

Trade Compliance

DRV102TG3 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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