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DM74LS447M

Texas Instruments

DM74LS447M by Texas Instruments

The Texas Instruments DM74LS447M is a TTL decoder with 16 terminals and open-collector outputs. It operates at a supply voltage range of 4.75V to 5.25V, with a propagation delay of 100ns. This small outline package is ideal for commercial applications requiring inverted output polarity and standard input conditioning.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 5,164 parts In-Stock

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Vyrian

USA . 3,041 parts In-Stock

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Anansix

USA . 2,158 parts In-Stock

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One Stop Electronics

USA . 938 parts In-Stock

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$7.000

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938

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Parana Technologies

USA . 1,142 parts In-Stock

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$11.031

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$11.491

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$11.031

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ChromeModa Solutions

Germany . 526 parts In-Stock

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$12.394

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$10.163

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526

$12.394

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IDEA Electronic Components Group

UK . 427 parts In-Stock

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$12.394

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$11.774

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$11.155

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427

$12.394

$11.774

$11.155

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AZTECH Wire

Italy . 314 parts In-Stock

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$17.206

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Corphita

USA . 2,644 parts In-Stock

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Supply Digital

USA . 2,437 parts In-Stock

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Northwest PG Solutions

USA . 959 parts In-Stock

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DigiPath Technology Company

USA . 425 parts In-Stock

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$11.174

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Native Components

USA . 332 parts In-Stock

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Overview

Elevate your projects with the DM74LS447M by Texas Instruments, a top-tier manufacturer known for its quality and reliability. This decoder & driver offers unparalleled performance and precision, making it perfect for a wide range of applications. With its small outline package and inverted output polarity, this versatile component provides exceptional value and efficiency. Trust in Texas Instruments to deliver cutting-edge technology that meets your needs and exceeds your expectations. Elevate your designs with the DM74LS447M today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the decoder & drivers, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards without the need for additional components or hardware.

Input Conditioning: STANDARD

Ensures compatibility with a wide range of input signals, making this product versatile for various applications.

Nominal Supply Voltage: 5V

Standard voltage requirement that is commonly used in many electronic systems, ensuring compatibility with existing setups.

Propagation Delay: 100 ns

Quick response time ensures rapid processing of signals, making this product suitable for real-time applications.

Maximum Operating Temperature: 70 °C

Can operate effectively in high-temperature environments, making it suitable for industrial applications.

Output Characteristics: OPEN-COLLECTOR

Provides flexibility in output connections, allowing for easy integration with other components or systems.

Technology: TTL

TTL technology offers high speed and reliability, making this product suitable for demanding applications.

Technical Specifications

Decoder & Drivers DM74LS447M attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Family:

LS

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-COLLECTOR

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Propagation Delay (tpd):

100 ns

Maximum Seated Height:

1.753 mm

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

DM74LS447M Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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