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DM74LS42N

Texas Instruments

DM74LS42N by Texas Instruments

The Texas Instruments DM74LS42N is a TTL decoder with 16 terminals, operating at 5V. It features a propagation delay of 35ns and inverted output polarity. This rectangular package is commonly used in standard input conditioning applications due to its commercial temperature grade and through-hole terminal form.

Median Price

$0.500

Lifecycle Status

Suppliers In-Stock

26

In-Stock Inventory

1k+

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American Microsemiconductor Inc.

USA . 12 parts In-Stock

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$0.490

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Component Electronics Inc.

Canada . 5 parts In-Stock

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$0.500

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$0.380

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$0.330

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Forefront Electronics and Design

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Vyrian

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Digiode

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Anansix

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GES GmbH

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MISTER SPROCKETS

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Inland Empire Components Inc.

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ComSIT Distribution GmbH

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A&K Electronics

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Rotakorn

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Bristol Electronics

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Electronic Expediters

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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Prism Electronics

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Semi Source

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Mentor Electronics Marketing, LLC

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Ack Elektronik San.Tic.Ltd.Sti

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First Choice Components Inc.

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M&R Communications

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MRC Electronics

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Pride Electronics

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PC Components Company LLC

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LittleDiode

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One Stop Electronics

USA . 1,323 parts In-Stock

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Parana Technologies

USA . 437 parts In-Stock

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$14.258

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DigiPath Technology Company

USA . 160 parts In-Stock

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ChromeModa Solutions

Germany . 5,364 parts In-Stock

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IDEA Electronic Components Group

UK . 1,946 parts In-Stock

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AZTECH Wire

Italy . 456 parts In-Stock

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Corphita

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Supply Digital

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Native Components

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Assy Fe

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Cyclops Electronics Ltd (Excess)

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Northwest PG Solutions

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Overview

Unleash the power of innovation with the DM74LS42N by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and reliability in every product they produce. The DM74LS42N falls under the category of Decoder & Drivers, offering versatile applications across various electronic devices. With a nominal supply voltage of 5V and a speedy propagation delay of 35 ns, this decoder promises seamless performance. Experience the value and benefits of Texas Instruments' cutting-edge technology with the DM74LS42N, catering to all your decoding needs with precision and efficiency. Elevate your projects to new heights with this exceptional product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the product lightweight and durable, making it suitable for various applications.

Input Conditioning: STANDARD

Standard input conditioning ensures compatibility with a wide range of input signals, making the product versatile.

Nominal Supply Voltage / Vsup (V): 5

With a nominal supply voltage of 5V, the product can be easily integrated into existing systems without requiring additional power sources.

Propagation Delay (tpd): 35 ns

The low propagation delay of 35ns ensures fast response time, making the product suitable for applications requiring quick signal processing.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C allows the product to operate reliably in harsh environmental conditions.

Technology: TTL

The TTL technology ensures compatibility with TTL logic levels, making the product suitable for TTL-based systems.

Technical Specifications

Decoder & Drivers DM74LS42N attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Family:

LS

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDIP-T16

Length:

19.305 mm

Logic IC Type:

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Propagation Delay (tpd):

35 ns

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

DM74LS42N Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-076-8840, 5962010768840

NIIN

010768840

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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