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DM74LS42M

Texas Instruments

DM74LS42M by Texas Instruments

The Texas Instruments DM74LS42M is a TTL decoder with 16 terminals and inverted output polarity. It has a propagation delay of 35 ns, operates b/w 0-70°C, and supports a supply voltage range of 4.75-5.25 V. This small outline package is ideal for applications requiring standard input conditioning in commercial temperature grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,432 parts In-Stock

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Digiode

USA . 5,020 parts In-Stock

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5,020

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Anansix

USA . 1,491 parts In-Stock

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1,491

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Native Components

USA . 38 parts In-Stock

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$0.880

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38

$0.880

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Northwest PG Solutions

USA . 357 parts In-Stock

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$0.968

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357

$0.968

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One Stop Electronics

USA . 692 parts In-Stock

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$4.000

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692

$4.000

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Parana Technologies

USA . 163 parts In-Stock

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$9.640

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$10.231

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163

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$10.231

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DigiPath Technology Company

USA . 404 parts In-Stock

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$10.614

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404

$10.614

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IDEA Electronic Components Group

UK . 1,535 parts In-Stock

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$10.831

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$10.289

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$9.748

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1,535

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$10.289

$9.748

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ChromeModa Solutions

Germany . 1,124 parts In-Stock

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$10.831

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$8.881

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$10.831

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AZTECH Wire

Italy . 701 parts In-Stock

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$13.017

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Corphita

USA . 4,619 parts In-Stock

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Supply Digital

USA . 2,875 parts In-Stock

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Overview

Unlock the potential of your electronic projects with the DM74LS42M by Texas Instruments. As a trusted leader in the industry, Texas Instruments ensures top-notch quality and reliability in all their products. The DM74LS42M belongs to the Decoder & Drivers category, offering versatile applications and seamless integration. With a nominal supply voltage of 5V and a propagation delay of 35 ns, this decoder promises efficient performance. Experience the value and benefits of this product, from its small outline package style to its inverted output polarity. Trust Texas Instruments to provide you with the tools you need for success in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material ensures durability and reliability of the product, making it a good choice for long-term use.

Surface Mount: YES

Surface mount capability allows for easy installation and integration into a variety of electronic devices, making it a versatile option.

Input Conditioning: STANDARD

Standard input conditioning ensures compatibility with a wide range of input signals, making it suitable for different applications.

Propagation Delay (tpd): 35 ns

Fast propagation delay of 35 ns ensures quick response and processing of input signals, making it efficient for time-sensitive operations.

Minimum Operating Temperature: 0 °C

Wide operating temperature range from 0°C ensures functionality in various environmental conditions, making it a reliable choice for different settings.

Technical Specifications

Decoder & Drivers DM74LS42M attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Family:

LS

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

Logic IC Type:

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Propagation Delay (tpd):

35 ns

Maximum Seated Height:

1.753 mm

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

DM74LS42M Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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