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DM54LS74AW

Texas Instruments

DM54LS74AW by Texas Instruments

DM54LS74AW by Texas Instruments is a TTL technology latches & flip-flops with 2 functions, operating at 5V. It has a max frequency of 20MHz, operates b/w -55 to 125°C, and supports positive edge triggering. Ideal for military-grade applications requiring high-speed data storage and retrieval.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,576 parts In-Stock

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4,576

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Vyrian

USA . 2,926 parts In-Stock

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2,926

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Anansix

USA . 1,554 parts In-Stock

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1,554

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Distributors (Availability)

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Native Components

USA . 367 parts In-Stock

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$5.330

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367

$5.330

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Parana Technologies

USA . 327 parts In-Stock

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$12.000

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$12.406

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327

$12.000

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$12.406

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ChromeModa Solutions

Germany . 4,665 parts In-Stock

1+ parts

$13.483

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$11.056

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4,665

$13.483

$11.056

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IDEA Electronic Components Group

UK . 86 parts In-Stock

1+ parts

$13.483

100+ parts

$12.809

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$12.135

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86

$13.483

$12.809

$12.135

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AZTECH Wire

Italy . 538 parts In-Stock

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$17.364

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538

$17.364

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One Stop Electronics

USA . 403 parts In-Stock

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$51.000

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403

$51.000

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Corphita

USA . 2,344 parts In-Stock

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2,344

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DigiPath Technology Company

USA . 2,159 parts In-Stock

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$12.156

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2,159

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$12.156

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Supply Digital

USA . 1,295 parts In-Stock

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1,295

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Northwest PG Solutions

USA . 209 parts In-Stock

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$5.223

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209

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$5.223

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Overview

Unlock the power of innovation with the Texas Instruments DM54LS74AW latches & flip-flops. Crafted with precision and reliability in mind, this product embodies the high quality and standards that Texas Instruments is known for. Perfect for a wide range of applications, this versatile component offers unparalleled value and benefits to customers. Enhance your projects with the superior performance and efficiency that only Texas Instruments can deliver.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages provide excellent heat dissipation, making this product suitable for high temperature applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient automated assembly of the product onto circuit boards.

No. of Functions: 2

Having 2 functions in one component saves space on the PCB and reduces the overall component count, simplifying the design.

Nominal Supply Voltage / Vsup (V): 5

Operating at a common 5V supply voltage makes this latch & flip-flop compatible with a wide range of digital circuits.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this product is suitable for harsh industrial environments.

Trigger Type: POSITIVE EDGE

Positive edge triggering ensures precise data capture and synchronization in digital systems.

Temperature Grade: MILITARY

Military grade temperature specifications indicate high reliability and durability in extreme conditions.

Technology: TTL

Using TTL technology ensures fast switching speeds and low power consumption, making this product ideal for high-speed applications.

Technical Specifications

Latches & Flip-Flops DM54LS74AW attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

JESD-30 Code:

R-XDFP-F14

Logic IC Type:

Maximum Frequency At Nominal Supply:

20000000 Hz

Maximum I (ol):

4 Amp

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DFP

Package Equivalence Code:

FL14,.3

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

8 mA

Qualification:

Not Qualified

Sub-Category:

FF/Latches

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Trade Compliance

DM54LS74AW Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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