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DLPA200PFCT

Texas Instruments

DLPA200PFCT by Texas Instruments

DLPA200PFCT by Texas Instruments is an 80-terminal interface IC with a supply voltage range of 10.8V to 13.2V, suitable for commercial extended temperature applications. It features a thin profile flatpack package style and gull wing terminal form, making it ideal for surface mount designs requiring precise interface circuitry in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,024 parts In-Stock

1+ parts

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100+ parts

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9,024

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Digiode

USA . 4,970 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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4,970

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 120 parts In-Stock

1+ parts

$0.113

100+ parts

-

1k+ parts

-

10k+ parts

$0.108

120

$0.113

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-

$0.108

Northwest PG Solutions

USA . 2,258 parts In-Stock

1+ parts

$0.124

100+ parts

-

1k+ parts

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$0.109

2,258

$0.124

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-

$0.109

Parana Technologies

USA . 812 parts In-Stock

1+ parts

$4.307

100+ parts

-

1k+ parts

$4.730

10k+ parts

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812

$4.307

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$4.730

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One Stop Electronics

USA . 1,569 parts In-Stock

1+ parts

$4.500

100+ parts

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1,569

$4.500

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DigiPath Technology Company

USA . 634 parts In-Stock

1+ parts

$4.742

100+ parts

$4.363

1k+ parts

-

10k+ parts

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634

$4.742

$4.363

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ChromeModa Solutions

Germany . 6,427 parts In-Stock

1+ parts

$4.839

100+ parts

$3.968

1k+ parts

-

10k+ parts

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6,427

$4.839

$3.968

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IDEA Electronic Components Group

UK . 180 parts In-Stock

1+ parts

$4.839

100+ parts

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1k+ parts

$4.355

10k+ parts

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180

$4.839

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$4.355

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AZTECH Wire

Italy . 580 parts In-Stock

1+ parts

$9.721

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580

$9.721

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QUARKTWIN TECHNOLOGY LTD

USA . 10,291 parts In-Stock

1+ parts

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10,291

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Corphita

USA . 1,010 parts In-Stock

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1,010

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Microchip USA

USA . 206 parts In-Stock

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206

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Overview

Elevate your electronic designs with the DLPA200PFCT by Texas Instruments, a cutting-edge Interface IC that sets new standards for quality and performance. Manufactured by industry leader Texas Instruments, this product boasts a sleek square package body made of durable plastic/epoxy, ensuring reliability in various applications. From consumer electronics to industrial automation, this Interface IC offers unparalleled value, benefits, and advantages to customers seeking superior functionality and efficiency. Upgrade your projects with the DLPA200PFCT and experience innovation like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides durability and protection for the internal components of the IC, ensuring long-term reliability.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving space and simplifying manufacturing processes.

Maximum Supply Voltage: 13.2 V

With a high maximum supply voltage, this IC can effectively handle power fluctuations and high voltage inputs, making it versatile and reliable.

Package Shape: SQUARE

The square package shape allows for efficient use of space on circuit boards and facilitates easy alignment during assembly.

No. of Terminals: 80

Having 80 terminals provides ample connection points for various input and output signals, making this IC suitable for complex interface applications.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

The flatpack, thin profile, and fine pitch package style enables a compact design, ideal for space-constrained applications.

Minimum Supply Voltage: 10.8 V

With a low minimum supply voltage, this IC can operate efficiently even at lower power levels, enhancing its energy efficiency.

Maximum Operating Temperature: 75 °C

The high maximum operating temperature tolerance of 75°C ensures reliable performance in a variety of environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C guarantees functionality even in cold environments, enhancing the versatility of this IC.

Terminal Position: QUAD

The quad terminal position provides a secure and stable connection on the circuit board, reducing the risk of signal interference or disconnection.

Maximum Seated Height: 1.2 mm

With a low maximum seated height of 1.2 mm, this IC can be easily integrated into compact electronic devices with minimal space requirements.

Width: 12 mm

The 12 mm width of the IC allows for efficient placement on the circuit board without occupying excessive space, contributing to a neat and organized layout.

Length: 12 mm

The 12 mm length of the IC ensures a compact form factor, making it suitable for applications where size constraints are a concern.

Temperature Grade: COMMERCIAL EXTENDED

The commercial extended temperature grade indicates that this IC can operate reliably in a wide range of temperature conditions, offering flexibility in usage.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and mounting on the circuit board, ensuring a secure and reliable connection.

Nominal Supply Voltage: 12 V

The 12 V nominal supply voltage is a commonly used standard, making this IC compatible with a wide range of power sources and systems.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch enables precise and compact placement of the IC on the circuit board, improving signal integrity and reducing the risk of crosstalk.

Interface IC Type: INTERFACE CIRCUIT

As an interface circuit IC type, this product is designed to facilitate communication between different electronic components or systems, making it a versatile solution for various applications.

Technical Specifications

Other Function Interface ICs DLPA200PFCT attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

S-PQFP-G80

Length:

12 mm

No. of Functions:

1

No. of Terminals:

80

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage:

13.2 V

Minimum Supply Voltage:

10.8 V

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

12 mm

Trade Compliance

DLPA200PFCT Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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