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DLP9500BFLN

Texas Instruments

DLP9500BFLN by Texas Instruments

DLP9500BFLN by Texas Instruments is a consumer IC with 355 terminals in a square grid array package. It operates b/w 20-70°C, with supply voltage ranging from 3-3.6V. Its ceramic-metal-sealed co-fired body makes it suitable for various consumer circuit applications.

Median Price

$2,837.453

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 318 parts In-Stock

1+ parts

$2,837.453

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318

$2,837.453

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 641 parts In-Stock

1+ parts

$2,695.580

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641

$2,695.580

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Vyrian

USA . 6,190 parts In-Stock

1+ parts

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6,190

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Chip Stock

USA . 208 parts In-Stock

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208

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 1,302 parts In-Stock

1+ parts

$1.000

100+ parts

$1.000

1k+ parts

$1.000

10k+ parts

$1.000

1,302

$1.000

$1.000

$1.000

$1.000

Native Components

USA . 510 parts In-Stock

1+ parts

$1.040

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-

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510

$1.040

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Northwest PG Solutions

USA . 1,579 parts In-Stock

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$1.144

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1,579

$1.144

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Parana Technologies

USA . 406 parts In-Stock

1+ parts

$2.781

100+ parts

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1k+ parts

$3.266

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406

$2.781

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$3.266

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ChromeModa Solutions

Germany . 2,174 parts In-Stock

1+ parts

$3.125

100+ parts

$2.562

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2,174

$3.125

$2.562

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IDEA Electronic Components Group

UK . 686 parts In-Stock

1+ parts

$3.125

100+ parts

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$2.812

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686

$3.125

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$2.812

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AZTECH Wire

Italy . 744 parts In-Stock

1+ parts

$10.470

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744

$10.470

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Corphita

USA . 105 parts In-Stock

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$2,553.708

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105

$2,553.708

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Lixinc

USA . 18,640 parts In-Stock

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18,640

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Kepictronics

USA . 2,000 parts In-Stock

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2,000

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DigiPath Technology Company

USA . 530 parts In-Stock

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100+ parts

$2.818

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530

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$2.818

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Overview

Experience cutting-edge technology with the DLP9500BFLN by Texas Instruments, a high-quality consumer IC that offers unparalleled performance and reliability. Manufactured by industry leader Texas Instruments, this product boasts a ceramic, metal-sealed cofired package body material for enhanced durability. With its versatile applications in various consumer circuits, this square-shaped IC provides customers with superior value and benefits. Trust Texas Instruments to deliver innovative solutions that cater to your needs and exceed your expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

Ceramic and metal-sealed cofired package body material provides excellent durability and reliability, ensuring a long lifespan for the product.

Surface Mount: YES

Being surface mountable makes the product easier to integrate into a variety of electronic systems, saving space and simplifying production processes.

Package Shape: SQUARE

The square package shape allows for easier and more efficient placement on circuit boards, optimizing space usage and enabling a more organized layout.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature of 70°C, this product can withstand elevated temperatures and maintain optimal performance in various environments.

No. of Terminals: 355

Having a high number of terminals provides ample connectivity options, allowing for versatile use and compatibility with a wide range of electronic devices.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish offers excellent conductivity and corrosion resistance, ensuring stable electrical connections and long-term reliability.

Minimum Supply Voltage (Vsup): 3 V

The low minimum supply voltage requirement of 3V allows for efficient power consumption and compatibility with a variety of power sources, making the product versatile and energy-efficient.

Technical Specifications

Other Function Consumer ICs DLP9500BFLN attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-CBGA-B355

JESD-609 Code:

e4

Length:

42.16 mm

No. of Functions:

1

No. of Terminals:

355

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

20 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

4.07 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Position:

BOTTOM

Width:

42.16 mm

Trade Compliance

DLP9500BFLN General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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