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DLP9000XFLS

Texas Instruments

DLP9000XFLS by Texas Instruments

DLP9000XFLS by Texas Instruments is a consumer IC with 355 terminals in a square grid array package. It operates b/w 0-70°C, with supply voltage ranging from 3-3.6V. This IC is ideal for applications requiring high-resolution imaging and projection systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,135 parts In-Stock

1+ parts

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4,135

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Digiode

USA . 2,201 parts In-Stock

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2,201

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Distributors (Availability)

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Parana Technologies

USA . 1,740 parts In-Stock

1+ parts

$1.108

100+ parts

-

1k+ parts

$1.942

10k+ parts

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1,740

$1.108

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$1.942

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DigiPath Technology Company

USA . 1,784 parts In-Stock

1+ parts

$1.220

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1,784

$1.220

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ChromeModa Solutions

Germany . 6,628 parts In-Stock

1+ parts

$1.245

100+ parts

$1.021

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6,628

$1.245

$1.021

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IDEA Electronic Components Group

UK . 1,703 parts In-Stock

1+ parts

$1.245

100+ parts

-

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$1.120

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1,703

$1.245

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$1.120

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Native Components

USA . 235 parts In-Stock

1+ parts

$1.604

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235

$1.604

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Northwest PG Solutions

USA . 1,843 parts In-Stock

1+ parts

$1.764

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1,843

$1.764

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One Stop Electronics

USA . 1,001 parts In-Stock

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$5.800

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1,001

$5.800

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AZTECH Wire

Italy . 398 parts In-Stock

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$12.643

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398

$12.643

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Corphita

USA . 791 parts In-Stock

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791

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Microchip USA

USA . 471 parts In-Stock

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471

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Overview

Experience unparalleled quality and innovation with the DLP9000XFLS by Texas Instruments, a cutting-edge consumer IC that is setting new standards in the industry. With a package body material of ceramic and metal-sealed cofired technology, this square-shaped IC boasts 355 terminals and a grid array package style. From commercial applications to personal projects, this versatile IC offers superior performance and reliability. Trust Texas Instruments to deliver top-of-the-line products that exceed expectations, providing you with the value, benefits, and advantages you need to succeed. Elevate your projects with the DLP9000XFLS and experience the difference today.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired materials ensures that the IC is durable and resistant to heat, making it suitable for a wide range of applications.

Surface Mount: YES

Being surface mountable allows for easy installation and integration into various electronic devices, saving space and simplifying the assembly process.

Maximum Operating Temperature: 70 °C

The ability to operate at a maximum temperature of 70°C indicates that the IC can be used in environments with varying temperature conditions without compromising performance.

Minimum Supply Voltage (Vsup): 3 V

The low minimum supply voltage requirement of 3V makes this IC energy efficient and suitable for battery-operated devices, extending their battery life.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel, palladium, and gold for terminal finish ensures good conductivity, corrosion resistance, and reliability, providing stable and efficient electrical connections.

Technical Specifications

Other Function Consumer ICs DLP9000XFLS attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

Additional Features:

SEATED HGT-CALCULATED

General IC Type:

JESD-30 Code:

S-CBGA-B355

JESD-609 Code:

e4

Length:

42.164 mm

No. of Functions:

1

No. of Terminals:

355

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

7.239 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Position:

BOTTOM

Width:

42.164 mm

Trade Compliance

DLP9000XFLS General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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