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DLP9000XBFLS

Texas Instruments

DLP9000XBFLS by Texas Instruments

DLP9000XBFLS by Texas Instruments is a consumer IC with 355 terminals in a square package. It operates b/w 0-70°C, with supply voltage ranging from 3-3.6V. Its ceramic-metal-sealed co-fired body makes it suitable for various consumer circuit applications like display technology and imaging systems.

Median Price

$6,548.540

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 23 parts In-Stock

1+ parts

$5,161.101

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23

$5,161.101

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Mouser Electronics

USA . 4 parts In-Stock

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$7,935.980

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4

$7,935.980

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,816 parts In-Stock

1+ parts

$4,903.046

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3,816

$4,903.046

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Vyrian

USA . 6,013 parts In-Stock

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6,013

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 564 parts In-Stock

1+ parts

$0.644

100+ parts

-

1k+ parts

$1.706

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564

$0.644

-

$1.706

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DigiPath Technology Company

USA . 2,054 parts In-Stock

1+ parts

$0.710

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2,054

$0.710

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ChromeModa Solutions

Germany . 2,701 parts In-Stock

1+ parts

$0.724

100+ parts

$0.594

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2,701

$0.724

$0.594

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IDEA Electronic Components Group

UK . 110 parts In-Stock

1+ parts

$0.724

100+ parts

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$0.652

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110

$0.724

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$0.652

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Microchip USA

USA . 729 parts In-Stock

1+ parts

$3.000

100+ parts

$1.000

1k+ parts

$1.000

10k+ parts

$1.000

729

$3.000

$1.000

$1.000

$1.000

Ampacity Inc.

Singapore . 10 parts In-Stock

1+ parts

$4,386.940

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10

$4,386.940

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Corphita

USA . 2,951 parts In-Stock

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$4,644.991

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2,951

$4,644.991

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Lixinc

USA . 10,787 parts In-Stock

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10,787

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QUARKTWIN TECHNOLOGY LTD

USA . 9,397 parts In-Stock

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9,397

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Kepictronics

USA . 2,000 parts In-Stock

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2,000

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Netroflash

USA . 500 parts In-Stock

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500

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Overview

Experience the unparalleled quality and innovation of Texas Instruments with the DLP9000XBFLS. This cutting-edge consumer circuit offers a wealth of applications in a sleek square package, making it ideal for a variety of projects. With surface mount capabilities and a rugged ceramic, metal-sealed body, this IC delivers reliable performance in any environment. Embrace the value and benefits of Texas Instruments technology with the DLP9000XBFLS, where quality meets versatility for your next project.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed cofired package body material provides excellent durability and protection for the IC, making it suitable for a wide range of applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving time and simplifying the manufacturing process.

Minimum Supply Voltage (Vsup): 3 V

The low minimum supply voltage requirement of 3V makes this IC suitable for use in applications where power efficiency is important.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this IC can withstand higher temperatures without compromising performance, making it ideal for applications that require reliability in varying conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel, palladium, gold terminal finish provides excellent conductivity and corrosion resistance, ensuring consistent performance over time.

No. of Terminals: 355

With a high number of terminals, this IC can support complex circuit configurations, offering flexibility and versatility in design.

Technical Specifications

Other Function Consumer ICs DLP9000XBFLS attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

Additional Features:

SEATED HGT-CALCULATED

General IC Type:

JESD-30 Code:

S-CBGA-B355

JESD-609 Code:

e4

Length:

42.164 mm

No. of Functions:

1

No. of Terminals:

355

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

7.239 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Width:

42.164 mm

Trade Compliance

DLP9000XBFLS General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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