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DLP9000BFLS

Texas Instruments

DLP9000BFLS by Texas Instruments

DLP9000BFLS by Texas Instruments is a consumer IC with 355 terminals in a square grid array package. It operates b/w 0-70°C, with supply voltage ranging from 3-3.6V. This IC is ideal for applications requiring high-resolution imaging and projection systems.

Median Price

$3,612.676

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 15 parts In-Stock

1+ parts

$3,228.513

100+ parts

-

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15

$3,228.513

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Arrow

USA . 12 parts In-Stock

1+ parts

-

100+ parts

$3,996.840

1k+ parts

-

10k+ parts

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12

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$3,996.840

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,156 parts In-Stock

1+ parts

$3,067.087

100+ parts

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1,156

$3,067.087

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Vyrian

USA . 7,696 parts In-Stock

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7,696

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 1,144 parts In-Stock

1+ parts

$2.000

100+ parts

$1.000

1k+ parts

$1.000

10k+ parts

$1.000

1,144

$2.000

$1.000

$1.000

$1.000

Parana Technologies

USA . 1,649 parts In-Stock

1+ parts

$2.283

100+ parts

-

1k+ parts

$2.783

10k+ parts

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1,649

$2.283

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$2.783

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DigiPath Technology Company

USA . 1,400 parts In-Stock

1+ parts

$2.514

100+ parts

$2.313

1k+ parts

-

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1,400

$2.514

$2.313

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ChromeModa Solutions

Germany . 6,078 parts In-Stock

1+ parts

$2.565

100+ parts

$2.103

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-

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6,078

$2.565

$2.103

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IDEA Electronic Components Group

UK . 872 parts In-Stock

1+ parts

$2.565

100+ parts

-

1k+ parts

$2.308

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872

$2.565

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$2.308

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AZTECH Wire

Italy . 825 parts In-Stock

1+ parts

$14.170

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825

$14.170

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Corphita

USA . 86 parts In-Stock

1+ parts

$2,905.662

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86

$2,905.662

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Northwest PG Solutions

USA . 1,425 parts In-Stock

1+ parts

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$4.018

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1,425

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$4.018

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Native Components

USA . 622 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$3.977

10k+ parts

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622

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$3.977

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Perfect Parts

USA . 141 parts In-Stock

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141

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Overview

Unleash the power of cutting-edge technology with the DLP9000BFLS by Texas Instruments. Renowned for their top-notch quality and innovation, Texas Instruments delivers unmatched performance in the realm of consumer ICs. This versatile device, housed in a durable ceramic, metal-sealed package, opens up a world of possibilities in various applications. Elevate your projects with the reliability and precision of the DLP9000BFLS, offering customers unparalleled value and benefits that set them apart from the competition. Experience the difference with Texas Instruments today.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired material ensures high reliability and durability for the product, making it a good choice for long-term use.

Surface Mount: YES

The surface mount capability allows for easy installation and assembly, making the product suitable for mass production and efficient manufacturing processes.

Package Shape: SQUARE

The square package shape provides a compact and space-efficient design, making it suitable for applications where size and space constraints are important.

No. of Terminals: 355

The high number of terminals allows for versatile connectivity and functionality, making the product suitable for complex circuit designs and applications.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, the product can withstand demanding environmental conditions, ensuring reliable performance in a wide range of applications.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures that the product can operate in colder environments, making it versatile and suitable for various temperature conditions.

Minimum Supply Voltage (Vsup): 3 V

The low minimum supply voltage requirement makes the product energy-efficient and suitable for applications where power consumption is a concern.

Technical Specifications

Other Function Consumer ICs DLP9000BFLS attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

Additional Features:

SEATED HGT-CALCULATED

General IC Type:

JESD-30 Code:

S-CBGA-B355

JESD-609 Code:

e4

Length:

42.164 mm

No. of Functions:

1

No. of Terminals:

355

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

7.239 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Width:

42.164 mm

Trade Compliance

DLP9000BFLS General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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