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DLP2010NIRFQJ

Texas Instruments

DLP2010NIRFQJ by Texas Instruments

DLP2010NIRFQJ by Texas Instruments is a CONSUMER CIRCUIT IC in a CERAMIC, METAL-SEALED COFIRED package. It features a RECTANGULAR shape with GRID ARRAY style and BOTTOM terminals. Ideal for consumer electronics applications requiring surface mount technology.

Median Price

$124.990

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 20 parts In-Stock

1+ parts

$124.990

100+ parts

$122.500

1k+ parts

$120.000

10k+ parts

-

20

$124.990

$122.500

$120.000

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,024 parts In-Stock

1+ parts

$118.740

100+ parts

-

1k+ parts

-

10k+ parts

-

1,024

$118.740

-

-

-

Vyrian

USA . 5,577 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,577

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,922 parts In-Stock

1+ parts

$0.186

100+ parts

-

1k+ parts

$1.515

10k+ parts

-

1,922

$0.186

-

$1.515

-

ChromeModa Solutions

Germany . 4,382 parts In-Stock

1+ parts

$0.209

100+ parts

$0.171

1k+ parts

-

10k+ parts

-

4,382

$0.209

$0.171

-

-

IDEA Electronic Components Group

UK . 909 parts In-Stock

1+ parts

$0.209

100+ parts

-

1k+ parts

$0.188

10k+ parts

-

909

$0.209

-

$0.188

-

Northwest PG Solutions

USA . 1,478 parts In-Stock

1+ parts

$3.329

100+ parts

-

1k+ parts

-

10k+ parts

-

1,478

$3.329

-

-

-

AZTECH Wire

Italy . 138 parts In-Stock

1+ parts

$11.250

100+ parts

-

1k+ parts

-

10k+ parts

-

138

$11.250

-

-

-

Corphita

USA . 1,965 parts In-Stock

1+ parts

$112.491

100+ parts

-

1k+ parts

-

10k+ parts

-

1,965

$112.491

-

-

-

DigiPath Technology Company

USA . 1,082 parts In-Stock

1+ parts

-

100+ parts

$0.188

1k+ parts

-

10k+ parts

-

1,082

-

$0.188

-

-

Native Components

USA . 817 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.935

10k+ parts

-

817

-

-

$2.935

-

Microchip USA

USA . 232 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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232

-

-

-

-

Overview

Experience the cutting-edge technology of the DLP2010NIRFQJ by Texas Instruments, a top-tier manufacturer known for innovation and reliability. This consumer IC offers endless possibilities for applications in various industries, providing high-quality performance and efficiency. With its ceramic, metal-sealed cofired body material and grid array package style, this product is designed to meet the demands of today's fast-paced world. Elevate your projects with the value, benefits, and advantages that the DLP2010NIRFQJ brings to the table.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired material in the package body provides excellent thermal conductivity and durability, ensuring stable performance in various operating conditions.

Surface Mount: YES

Being surface mount compatible allows for easy and efficient assembly onto circuit boards, saving time and effort during manufacturing.

Package Shape: RECTANGULAR

The rectangular shape of the package offers efficient use of board space and facilitates easier placement and routing on the PCB.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, this IC offers features and functions tailored for consumer electronics, making it a suitable choice for a wide range of consumer products.

Package Style (Meter): GRID ARRAY

The grid array package style provides high density interconnection for improved signal integrity and reduced signal loss, making it ideal for applications requiring high-speed data processing.

Terminal Position: BOTTOM

Having terminals at the bottom of the package simplifies the PCB layout and improves signal routing, contributing to better signal performance and reliability.

Terminal Form: NO LEAD

The absence of leads in the terminal form reduces susceptibility to mechanical stress and solder joint failures, enhancing the overall ruggedness and reliability of the product.

Technical Specifications

Other Function Consumer ICs DLP2010NIRFQJ attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-CBGA-N40

Moisture Sensitivity Level (MSL):

1

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

LGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Surface Mount:

YES

Terminal Form:

Terminal Position:

BOTTOM

Trade Compliance

DLP2010NIRFQJ General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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