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DLP2010LCFQJ

Texas Instruments

DLP2010LCFQJ by Texas Instruments

DLP2010LCFQJ by Texas Instruments is a consumer IC with 40 terminals in a rectangular package. It operates b/w 0-70°C, with supply voltage ranging from 1.65V to 1.95V. This metal-sealed co-fired ceramic IC is ideal for various consumer circuit applications due to its compact size and surface-mount capability.

Median Price

$54.055

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 114 parts In-Stock

1+ parts

$54.055

100+ parts

$48.049

1k+ parts

$35.330

10k+ parts

-

114

$54.055

$48.049

$35.330

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 914 parts In-Stock

1+ parts

$51.352

100+ parts

-

1k+ parts

-

10k+ parts

-

914

$51.352

-

-

-

Bristol Electronics

USA . 195 parts In-Stock

1+ parts

$60.000

100+ parts

$49.200

1k+ parts

-

10k+ parts

-

195

$60.000

$49.200

-

-

Vyrian

USA . 1,942 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,942

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 161 parts In-Stock

1+ parts

$0.707

100+ parts

-

1k+ parts

$1.738

10k+ parts

-

161

$0.707

-

$1.738

-

DigiPath Technology Company

USA . 717 parts In-Stock

1+ parts

$0.778

100+ parts

$0.716

1k+ parts

-

10k+ parts

-

717

$0.778

$0.716

-

-

ChromeModa Solutions

Germany . 3,435 parts In-Stock

1+ parts

$0.794

100+ parts

$0.651

1k+ parts

-

10k+ parts

-

3,435

$0.794

$0.651

-

-

IDEA Electronic Components Group

UK . 1,165 parts In-Stock

1+ parts

$0.794

100+ parts

-

1k+ parts

$0.715

10k+ parts

-

1,165

$0.794

-

$0.715

-

Native Components

USA . 136 parts In-Stock

1+ parts

$8.245

100+ parts

-

1k+ parts

-

10k+ parts

-

136

$8.245

-

-

-

Northwest PG Solutions

USA . 2,185 parts In-Stock

1+ parts

$9.069

100+ parts

$8.162

1k+ parts

-

10k+ parts

-

2,185

$9.069

$8.162

-

-

AZTECH Wire

Italy . 574 parts In-Stock

1+ parts

$13.290

100+ parts

-

1k+ parts

-

10k+ parts

-

574

$13.290

-

-

-

Corphita

USA . 881 parts In-Stock

1+ parts

$48.650

100+ parts

-

1k+ parts

-

10k+ parts

-

881

$48.650

-

-

-

Microchip USA

USA . 2,284 parts In-Stock

1+ parts

$116.340

100+ parts

$114.320

1k+ parts

$113.300

10k+ parts

$112.290

2,284

$116.340

$114.320

$113.300

$112.290

QUARKTWIN TECHNOLOGY LTD

USA . 27,136 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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27,136

-

-

-

-

Authorized Procurement Solutions

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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500

-

-

-

-

Overview

Experience the innovation and quality of Texas Instruments with the DLP2010LCFQJ, a cutting-edge consumer IC that offers unrivaled performance and reliability. This rectangular grid array package boasts a ceramic, metal-sealed cofired body material for durability and optimal functionality. Whether you're in need of superior image projection, precise measurement solutions, or advanced sensing applications, this versatile IC has you covered. Trust Texas Instruments to deliver top-of-the-line technology that exceeds expectations and unlocks endless possibilities. Elevate your projects with the DLP2010LCFQJ and discover a world of value, benefits, and advantages like never before.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired material ensures high durability and resistance to environmental factors, making this product suitable for long-term use in various conditions.

Surface Mount: YES

Being surface mountable simplifies the installation process and allows for easier integration into electronic circuitry.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer circuits, this product is optimized for efficiency and reliability in consumer electronic devices.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures that the product can withstand heat without compromising performance, making it suitable for a wide range of applications.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows the product to function effectively even in colder environments, increasing its versatility.

Width: 5.3 mm

The compact width of the package makes the product space-efficient and suitable for applications where size constraints are a concern.

Terminal Form: NO LEAD

The use of lead-free terminals aligns with environmental regulations and reduces the risk of harmful lead exposure during product handling and disposal.

Technical Specifications

Other Function Consumer ICs DLP2010LCFQJ attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

Additional Features:

SEATED HGT-CALCULATED

General IC Type:

JESD-30 Code:

R-CBGA-N40

Length:

15.9 mm

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

LGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

4.303 mm

Maximum Supply Voltage (Vsup):

1.95 V

Minimum Supply Voltage (Vsup):

1.65 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Position:

BOTTOM

Width:

5.3 mm

Trade Compliance

DLP2010LCFQJ General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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