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DHDLF2406APZA

Texas Instruments

DHDLF2406APZA by Texas Instruments

DHDLF2406APZA by Texas Instruments is a 100-terminal DSP with 16-bit address and data bus width, operating at up to 20 MHz. Ideal for industrial applications, it features low power mode, barrel shifter, and boundary scan capability.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,536 parts In-Stock

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Digiode

USA . 1,062 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 414 parts In-Stock

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$1.035

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$1.035

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Northwest PG Solutions

USA . 1,087 parts In-Stock

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$1.138

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AZTECH Wire

Italy . 277 parts In-Stock

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$10.033

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One Stop Electronics

USA . 805 parts In-Stock

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$11.000

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805

$11.000

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Corohmni

South Africa . 50 parts In-Stock

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$60.969

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Parana Technologies

USA . 202 parts In-Stock

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$69.128

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DigiPath Technology Company

USA . 86 parts In-Stock

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$76.119

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$70.029

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ChromeModa Solutions

Germany . 728 parts In-Stock

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$77.672

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$63.691

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IDEA Electronic Components Group

UK . 408 parts In-Stock

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$77.672

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$73.788

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$69.905

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Perfect Parts

USA . 1,613 parts In-Stock

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Corphita

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Overview

Experience unparalleled performance and reliability with the Texas Instruments DHDLF2406APZA Digital Signal Processor. Crafted by a leading manufacturer, this DSP is designed to meet the highest industry standards, offering a wide range of applications in various fields. Unlock the power of cutting-edge technology with this product, delivering exceptional value and benefits to customers. From its durable construction to its high-speed processing capabilities, this DSP ensures seamless operation and superior performance for all your digital signal processing needs. Elevate your projects with the DHDLF2406APZA and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material helps in reducing the weight of the product, making it easier to handle and transport.

Surface Mount: YES

Surface mount technology enables automated assembly processes, increasing efficiency and precision in production.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for more flexibility in power input options, accommodating a wider range of applications.

Address Bus Width: 16

Address bus width of 16 provides ample address space for processing complex algorithms and large amounts of data.

Package Shape: SQUARE

Square package shape offers uniformity in design and facilitates efficient layout on circuit boards.

No. of Terminals: 100

Having 100 terminals allows for multiple connections and interfaces, enhancing the connectivity options of the DSP.

Minimum Supply Voltage: 3 V

Lower minimum supply voltage helps in conserving power and improving energy efficiency of the product.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability and stability of performance in a variety of industrial environments.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows the DSP to operate effectively even in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel, palladium, and gold terminal finish provides excellent conductivity and corrosion resistance for reliable connections.

Maximum Seated Height: 1.6 mm

Low maximum seated height enables slim and compact design of the product, saving space on the circuit board.

Maximum Clock Frequency: 20 MHz

High maximum clock frequency allows for fast processing of signals and data, enhancing the performance of the DSP.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the DSP can withstand harsh operating conditions typically found in industrial settings.

Technology: CMOS

CMOS technology offers low power consumption, high integration density, and compatibility with a wide range of digital systems.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage of 3.3 V ensures consistent and reliable performance of the DSP.

Moisture Sensitivity Level (MSL): 2

Moisture sensitivity level of 2 indicates that the DSP has moderate sensitivity to moisture exposure, requiring standard handling procedures.

Low Power Mode: YES

Incorporating a low power mode helps in reducing power consumption during idle or low activity periods, extending battery life.

Barrel Shifter: YES

Having a barrel shifter enables efficient bit shifting operations, improving the speed and performance of arithmetic and logic functions.

Technical Specifications

Digital Signal Processors (DSPs) DHDLF2406APZA attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

16

Barrel Shifter:

YES

Boundary Scan:

YES

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

DHDLF2406APZA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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