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DAC5682ZIRGC

Texas Instruments

DAC5682ZIRGC by Texas Instruments

DAC5682ZIRGC by Texas Instruments is a 16-bit D/A converter with 4.1V max analog output voltage, operating from -40 to 85°C. It features a sample rate of 1000MHz and uses CMOS technology, suitable for industrial applications requiring high-speed and precise analog signal generation.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,728 parts In-Stock

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Chip Stock

USA . 3,455 parts In-Stock

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Digiode

USA . 1,393 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 367 parts In-Stock

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$0.294

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$0.282

367

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$0.282

Northwest PG Solutions

USA . 368 parts In-Stock

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$0.323

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$0.285

368

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Parana Technologies

USA . 1,178 parts In-Stock

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$8.517

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$9.174

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$8.517

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ChromeModa Solutions

Germany . 2,371 parts In-Stock

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$9.570

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$7.847

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$9.570

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IDEA Electronic Components Group

UK . 2,203 parts In-Stock

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$9.570

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$9.092

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$8.613

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AZTECH Wire

Italy . 221 parts In-Stock

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$17.580

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One Stop Electronics

USA . 859 parts In-Stock

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$23.000

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Lixinc

USA . 10,404 parts In-Stock

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DigiPath Technology Company

USA . 1,359 parts In-Stock

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$8.628

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$8.628

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A-Z Elektronik GmbH

Germany . 1,359 parts In-Stock

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Corphita

USA . 978 parts In-Stock

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Overview

Enhance your digital applications with the DAC5682ZIRGC by Texas Instruments, a high-quality Digital-to-Analog Converter designed to deliver precision and reliability. Texas Instruments is renowned for its cutting-edge technology and this product is no exception. Ideal for industrial settings, this converter boasts a fast nominal settling time and a wide temperature range for optimal performance. With a compact package style and advanced features, the DAC5682ZIRGC offers exceptional value and benefits to customers seeking top-notch analog output voltage and unparalleled efficiency. Elevate your projects with Texas Instruments' DAC5682ZIRGC today!

Feature Benefit Bullets

Maximum Analog Output Voltage: 4.1 V

High maximum analog output voltage allows for greater flexibility and precision in output signal levels.

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides durability and reliability to the product.

Surface Mount: YES

The surface mount feature enables easy and efficient installation of the converter on circuit boards.

No. of Bits: 16

With 16 bits available, this converter offers high resolution and accuracy in converting digital signals to analog.

Nominal Settling Time (tstl): 0.0104 us

The fast settling time ensures quick and precise output responses, making it suitable for applications that require rapid signal processing.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range allows for reliable performance in various environmental conditions.

Technology: CMOS

The CMOS technology used in this converter ensures low power consumption and high noise immunity.

Sample Rate: 1000 MHz

The high sample rate allows for accurate and high-speed conversion of signals, making it suitable for demanding applications.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V ensures compatibility with a wide range of applications and power sources.

Technical Specifications

Digital-to-Analog Converters DAC5682ZIRGC attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

CMOS

Input Format:

Parallel, Word

Input Bit Code:

Offset Binary

Nominal Settling Time (tstl):

10.4 ns

Sample Rate:

1000 MHz

No. of Bits:

16

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

3.3 V

Minimum Analog Output Voltage:

2.5 V

Maximum Analog Output Voltage:

4.1 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

3

Form Factor

No. of Terminals:

64

Terminal Form:

Terminal Position:

Quad

Terminal Pitch:

0.02 in (0.5 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

Yes

Width:

0.354 in (9 mm)

Length:

0.354 in (9 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Trade Compliance

DAC5682ZIRGC Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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