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DAC5311IDCKTG4

Texas Instruments

DAC5311IDCKTG4 by Texas Instruments

DAC5311IDCKTG4 by Texas Instruments is an 8-bit D/A converter with a max analog output voltage of 5.5V and settling time of 10us. Ideal for automotive applications, it operates b/w -40 to 125°C, has a low supply current of 0.16mA, and uses a serial input format for binary coding.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 8,595 parts In-Stock

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Vyrian

USA . 7,322 parts In-Stock

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7,322

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Digiode

USA . 2,060 parts In-Stock

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2,060

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Nova Conductors

Japan . 600 parts In-Stock

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600

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Distributors (Availability)

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AZTECH Wire

Italy . 248 parts In-Stock

1+ parts

$9.771

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248

$9.771

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Parana Technologies

USA . 2,262 parts In-Stock

1+ parts

$17.357

100+ parts

$1,611.840

1k+ parts

$15.621

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2,262

$17.357

$1,611.840

$15.621

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Corohmni

South Africa . 509 parts In-Stock

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$18.306

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509

$18.306

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DigiPath Technology Company

USA . 827 parts In-Stock

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$19.112

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827

$19.112

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ChromeModa Solutions

Germany . 6,096 parts In-Stock

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$19.502

100+ parts

$15.992

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6,096

$19.502

$15.992

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IDEA Electronic Components Group

UK . 1,825 parts In-Stock

1+ parts

$19.502

100+ parts

$18.527

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$17.552

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1,825

$19.502

$18.527

$17.552

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One Stop Electronics

USA . 761 parts In-Stock

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$29.000

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761

$29.000

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Ampacity Inc.

Singapore . 865 parts In-Stock

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$33.000

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865

$33.000

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Continental Prestige Electronics

USA . 6,395 parts In-Stock

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Corphita

USA . 2,263 parts In-Stock

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Argo Parts USA

USA . 1,605 parts In-Stock

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Bastille Electronics

Australia . 1,000 parts In-Stock

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Overview

Unlock the power of precision with the DAC5311IDCKTG4 by Texas Instruments. Crafted with top-notch quality and expertise, this digital-to-analog converter is designed to deliver unparalleled performance in a wide range of applications. With a compact design and ease of integration, this product offers customers a seamless experience, providing precise analog output voltage up to 5.5V. Whether you're in the automotive industry or seeking high-grade solutions, the DAC5311IDCKTG4 is the perfect choice for maximizing efficiency and accuracy in your projects. Elevate your work with Texas Instruments and experience the difference today.

Feature Benefit Bullets

Maximum Analog Output Voltage 5.5 V

Provides a wide range of output voltages for versatile applications.

Package Body Material PLASTIC/EPOXY

Ensures durability and reliability in various environments.

Surface Mount YES

Allows for easy and secure mounting on circuit boards.

No. of Bits 8

Offers high resolution and accuracy in converting digital signals to analog.

Maximum Settling Time 10 us

Provides fast response time for real-time applications.

Maximum Linearity Error (EL) 0.0977 %

Ensures precise and consistent analog output.

Power Supplies (V) 2/5

Compatible with common power supply voltages for convenience.

No. of Terminals 6

Simplifies connections and integration with other components.

Package Style (Meter) SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Space-saving design for compact electronic devices.

Nominal Settling Time (tstl) 12 us

Offers quick stabilization for smooth and accurate analog output.

Maximum Operating Temperature 125 °C

Can withstand high temperature environments for versatile use.

Minimum Operating Temperature -40 °C

Operates reliably in extreme cold conditions as well.

Terminal Finish NICKEL PALLADIUM GOLD

Ensures reliable and corrosion-resistant connections for long-term use.

Terminal Position DUAL

Provides flexibility in PCB layout and connection options.

Maximum Seated Height 1.1 mm

Low profile design for compact electronic devices.

Width 1.25 mm

Small footprint for space-constrained applications.

Maximum Time At Peak Reflow Temperature (s) 30

Allows for safe and efficient soldering during assembly.

Peak Reflow Temperature °C 260

Withstands high reflow temperatures for manufacturing processes.

Minimum Analog Output Voltage 0 V

Capable of outputting zero voltage for specific applications.

Length 2 mm

Compact size for fitting into small electronic devices.

Temperature Grade AUTOMOTIVE

Suitable for automotive applications with wide temperature ranges.

Terminal Form GULL WING

Secure and reliable terminal design for soldering and connection.

Maximum Supply Current 0.16 mA

Low power consumption for energy-efficient operation.

Input Format SERIAL

Compatible with serial input signals for easy integration.

Converter Type D/A CONVERTER

Specifically designed for converting digital signals to analog voltages.

Nominal Supply Voltage 3 V

Compatible with a standard 3V power supply for ease of use.

Terminal Pitch 0.65 mm

Standard pitch size for easy integration into circuit boards.

Input Bit Code BINARY

Accepts binary input codes for seamless digital-to-analog conversion.

Technical Specifications

Digital-to-Analog Converters DAC5311IDCKTG4 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.0977 %

Nominal Settling Time (tstl):

12 µs

Maximum Supply Current:

160 μA

Maximum Settling Time:

10 µs

No. of Bits:

8

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

3 V

Minimum Analog Output Voltage:

0 V

Maximum Analog Output Voltage:

5.5 V

Power Supplies:

2/5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

1

Form Factor

No. of Terminals:

6

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

Yes

Width:

0.049 in (1.25 mm)

Length:

0.079 in (2 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Code:

Package Equivalence Code:

TSSOP6,.08

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Trade Compliance

DAC5311IDCKTG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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