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DAC5672IPFBRG4

Texas Instruments

DAC5672IPFBRG4 by Texas Instruments

DAC5672IPFBRG4 by Texas Instruments is a 14-bit D/A converter with max analog output voltage of 1.25V and linearity error of 0.0244%. It operates at industrial temperature range, suitable for applications requiring precise analog signal generation in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 5,850 parts In-Stock

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5,850

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Digiode

USA . 4,810 parts In-Stock

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4,810

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Vyrian

USA . 4,088 parts In-Stock

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4,088

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Distributors (Availability)

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Ampacity Inc.

Singapore . 648 parts In-Stock

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$11.000

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648

$11.000

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Corohmni

South Africa . 402 parts In-Stock

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$13.158

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402

$13.158

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AZTECH Wire

Italy . 303 parts In-Stock

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$13.799

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$13.799

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Parana Technologies

USA . 168 parts In-Stock

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$22.969

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$23.621

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168

$22.969

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$23.621

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DigiPath Technology Company

USA . 533 parts In-Stock

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$25.292

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$23.268

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533

$25.292

$23.268

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IDEA Electronic Components Group

UK . 500 parts In-Stock

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$25.808

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$24.518

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$23.227

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500

$25.808

$24.518

$23.227

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ChromeModa Solutions

Germany . 360 parts In-Stock

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$25.808

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$21.163

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One Stop Electronics

USA . 190 parts In-Stock

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$26.000

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Authorized Procurement Solutions

USA . 8,500 parts In-Stock

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Continental Prestige Electronics

USA . 2,270 parts In-Stock

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Argo Parts USA

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Corphita

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Kepictronics

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100

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Bastille Electronics

Australia . 50 parts In-Stock

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50

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Overview

Elevate your digital-to-analog conversion experience with the DAC5672IPFBRG4 by Texas Instruments. Known for their superior quality and innovative technology, Texas Instruments delivers cutting-edge solutions in the realm of Digital-to-Analog Converters. This product offers precision, reliability, and versatility, making it ideal for a wide range of applications. Experience seamless performance and exceptional value with the DAC5672IPFBRG4, setting new standards in the world of electronics. Upgrade your projects and unleash the full potential of your designs with this top-of-the-line DAC.

Feature Benefit Bullets

Maximum Analog Output Voltage: 1.25 V

This high maximum output voltage allows for accurate and precise analog signal generation.

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable for various applications.

Surface Mount: YES

Being surface mountable makes it easy to integrate into compact electronic designs.

No. of Functions: 2

With two functions, this converter offers versatility in signal processing capabilities.

Package Shape: SQUARE

The square shape of the package allows for efficient use of board space.

No. of Bits: 14

14 bits of resolution provide high accuracy in converting digital signals to analog.

Maximum Linearity Error (EL): 0.0244%

The low linearity error ensures accurate conversion of digital signals into analog output.

Power Supplies (V): 3.3

Operates efficiently with a 3.3V power supply, making it suitable for a wide range of applications.

No. of Terminals: 48

The large number of terminals allow for easy connectivity and integration into electronic circuits.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

The flatpack design with a thin profile and fine pitch makes it suitable for compact electronic assemblies.

Nominal Settling Time (tstl): 0.02 us

The fast settling time ensures quick response and accurate analog output.

Maximum Operating Temperature: 85 °C

Can operate effectively in high-temperature environments.

Minimum Operating Temperature: -40 °C

Can operate effectively in low-temperature environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel-palladium-gold finish ensures reliable and long-lasting electrical connections.

Terminal Position: QUAD

The quad terminal position allows for easy mounting on PCBs.

Maximum Seated Height: 1.2 mm

The low seated height makes it suitable for compact electronic designs.

Width: 7 mm

The compact width allows for space-efficient placement on circuit boards.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for a specified duration without damage.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures during assembly processes.

Minimum Analog Output Voltage: -1 V

Offers both positive and negative analog output voltage options for diverse signal requirements.

Length: 7 mm

The compact length allows for space-saving integration into electronic assemblies.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications with a wide operating temperature range.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high-speed operation.

Terminal Form: GULL WING

The gull-wing terminal form allows for easy soldering onto PCBs.

Input Format: PARALLEL, WORD

Supports parallel input format for easy interfacing with digital systems.

Converter Type: D/A CONVERTER

A digital-to-analog converter that ensures accurate conversion of digital signals.

Nominal Supply Voltage: 3.3 V

Operates efficiently with a 3.3V power supply, common in many electronic systems.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for compact placement on PCBs.

Moisture Sensitivity Level (MSL): 2

With MSL 2, this product is suitable for reflow soldering and moisture-resistant applications.

Input Bit Code: OFFSET BINARY

Supports offset binary input bit code for flexible signal processing options.

Technical Specifications

Digital-to-Analog Converters DAC5672IPFBRG4 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

CMOS

Sub-Category:

Other Converters

Input Format:

Parallel, Word

Input Bit Code:

Offset Binary

Maximum Linearity Error (EL):

0.0244 %

Nominal Settling Time (tstl):

20 ns

No. of Bits:

14

No. of Functions:

2

Electrical Specifications

Nominal Supply Voltage:

3.3 V

Minimum Analog Output Voltage:

-1 V

Maximum Analog Output Voltage:

1.25 V

Power Supplies:

3.3 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

2

Form Factor

No. of Terminals:

48

Terminal Form:

Terminal Position:

Quad

Terminal Pitch:

0.02 in (0.5 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Flatpack, Thin Profile, Fine Pitch

Package Code:

Package Equivalence Code:

TQFP48,.35SQ

Standards and Codes

Qualified:

No

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Trade Compliance

DAC5672IPFBRG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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