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DAC8554IPWRG4

Texas Instruments

DAC8554IPWRG4 by Texas Instruments

DAC8554IPWRG4 by Texas Instruments is a 16-bit D/A converter with 5.5V max analog output voltage and settling time of 10us. Ideal for industrial applications, it operates b/w -40 to 105°C, with a low supply current of 0.5mA.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 7,248 parts In-Stock

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Digiode

USA . 3,923 parts In-Stock

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Nova Conductors

Japan . 65 parts In-Stock

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One Stop Electronics

USA . 1,218 parts In-Stock

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$9.000

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$9.000

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Semicontronic

India . 1,558 parts In-Stock

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$12.000

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$11.700

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$11.640

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AZTECH Wire

Italy . 361 parts In-Stock

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$13.387

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Parana Technologies

USA . 1,577 parts In-Stock

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$16.595

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$16.864

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DigiPath Technology Company

USA . 1,948 parts In-Stock

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$18.273

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$16.811

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$18.273

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ChromeModa Solutions

Germany . 5,118 parts In-Stock

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$18.646

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$15.290

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IDEA Electronic Components Group

UK . 825 parts In-Stock

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$18.646

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$17.714

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$16.781

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$18.646

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$16.781

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Corohmni

South Africa . 540 parts In-Stock

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$21.044

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Ampacity Inc.

Singapore . 490 parts In-Stock

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$26.000

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Advanced Electronics

New Zealand . 50 parts In-Stock

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$27.490

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$26.115

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Continental Prestige Electronics

USA . 5,056 parts In-Stock

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Corphita

USA . 2,401 parts In-Stock

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Argo Parts USA

USA . 514 parts In-Stock

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Overview

Elevate your projects with the Texas Instruments DAC8554IPWRG4 Digital-to-Analog Converter. Crafted by a trusted manufacturer known for quality and reliability, this high-performance DAC offers precision and efficiency in converting digital signals to analog output. Ideal for industrial applications requiring accurate voltage outputs, the DAC8554IPWRG4 provides a seamless solution with a small footprint and low power consumption. Experience the value of enhanced performance and flexibility with this top-of-the-line converter from Texas Instruments.

Feature Benefit Bullets

Maximum Analog Output Voltage: 5.5 V

This high maximum analog output voltage allows for a wide range of voltage levels to be output, making this converter versatile for different applications.

No. of Bits: 16

Having 16 bits allows for high resolution and accuracy in converting digital signals to analog, ensuring precise output voltage levels.

Maximum Settling Time: 10 us

With a fast settling time, this converter can quickly stabilize the analog output voltage after a digital input signal is applied, reducing lag time.

Maximum Linearity Error (EL): 0.0183%

The low linearity error ensures that the output voltage closely follows the input digital signal, providing accurate and consistent conversion.

Temperature Grade: INDUSTRIAL

Being designed for industrial temperature ranges, this converter can operate reliably in harsh environments, making it suitable for industrial applications.

Input Format: SERIAL

With a serial input format, this converter can easily interface with digital systems using serial communication protocols, simplifying integration into existing setups.

Technical Specifications

Digital-to-Analog Converters DAC8554IPWRG4 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.0183 %

Nominal Settling Time (tstl):

12 µs

Maximum Supply Current:

500 μA

Maximum Settling Time:

10 µs

No. of Bits:

16

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

3 V

Minimum Analog Output Voltage:

0 V

Maximum Analog Output Voltage:

5.5 V

Power Supplies:

3/5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

105 °C (221 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

1

Form Factor

No. of Terminals:

16

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

Yes

Width:

0.173 in (4.4 mm)

Length:

0.197 in (5 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Code:

Package Equivalence Code:

TSSOP14,.25

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Trade Compliance

DAC8554IPWRG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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