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DAC5672AIPFBG4

Texas Instruments

DAC5672AIPFBG4 by Texas Instruments

DAC5672AIPFBG4 by Texas Instruments is a 14-bit D/A converter with 275 MHz sample rate, 0.0244% linearity error, and 3.3V nominal voltage. Ideal for industrial applications requiring precise analog output in a compact package with low power consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,272 parts In-Stock

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Vyrian

USA . 1,951 parts In-Stock

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Nova Conductors

Japan . 24 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 1,318 parts In-Stock

1+ parts

$6.000

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1,318

$6.000

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Corohmni

South Africa . 189 parts In-Stock

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$6.475

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189

$6.475

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AZTECH Wire

Italy . 742 parts In-Stock

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$11.664

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$11.664

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Ampacity Inc.

Singapore . 1,367 parts In-Stock

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$13.000

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$13.000

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Parana Technologies

USA . 587 parts In-Stock

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$24.389

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$25.065

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587

$24.389

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$25.065

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ChromeModa Solutions

Germany . 5,163 parts In-Stock

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$27.403

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$22.470

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$27.403

$22.470

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IDEA Electronic Components Group

UK . 1,140 parts In-Stock

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$27.403

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$26.033

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$24.663

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$27.403

$26.033

$24.663

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Continental Prestige Electronics

USA . 6,799 parts In-Stock

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Corphita

USA . 2,144 parts In-Stock

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DigiPath Technology Company

USA . 2,130 parts In-Stock

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$24.707

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Aranea Global

USA . 2,000 parts In-Stock

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Microchip USA

USA . 1,067 parts In-Stock

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Argo Parts USA

USA . 491 parts In-Stock

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491

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Overview

Unlock the power of precise analog output with the Texas Instruments DAC5672AIPFBG4 Digital-to-Analog Converter. Crafted with unparalleled quality and expertise, this innovative product offers customers unrivaled value and benefits for a wide range of applications. Say goodbye to compromise and hello to superior performance with the DAC5672AIPFBG4. Trust Texas Instruments to deliver excellence in every detail.

Feature Benefit Bullets

Maximum Analog Output Voltage: 1.25 V

Provides a high maximum analog output voltage, suitable for various applications requiring precise voltage levels.

Package Body Material: PLASTIC/EPOXY

Utilizes a durable and cost-effective plastic/epoxy package body material for reliable performance.

Surface Mount: YES

Allows for easy integration onto circuit boards with surface mount capability, saving space and simplifying assembly.

No. of Functions: 2

Offers multiple functions in a single component, increasing versatility and functionality in electronic designs.

Package Shape: SQUARE

Features a square package shape that enhances compatibility with standard PCB layouts and facilitates efficient placement.

No. of Bits: 14

Boasts a high number of bits for enhanced resolution and accuracy in converting digital signals to analog output.

Maximum Linearity Error (EL): 0.0244%

Ensures minimal linearity error, resulting in precise and consistent analog output signals.

Power Supplies (V): 3.3

Operates on a standard power supply voltage of 3.3V, suitable for most electronic systems.

No. of Terminals: 48

Provides a sufficient number of terminals for connection flexibility and compatibility with different circuit configurations.

Package Style: FLATPACK, THIN PROFILE, FINE PITCH

Features a package style that offers a compact design with a thin profile and fine pitch for space-saving benefits.

Nominal Settling Time (tstl): 0.02 us

Offers a quick settling time for rapid and accurate transitions between analog output levels.

Maximum Operating Temperature: 85 °C

Can operate effectively at high temperatures up to 85°C, suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Provides reliable performance even in low-temperature conditions down to -40°C.

Terminal Finish: NICKEL PALLADIUM GOLD

Utilizes a high-quality terminal finish of nickel, palladium, and gold for excellent conductivity and corrosion resistance.

Terminal Position: QUAD

Features quad terminal positions for secure and stable connections on the circuit board.

Technical Specifications

Digital-to-Analog Converters DAC5672AIPFBG4 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

CMOS

Sub-Category:

Other Converters

Input Format:

Parallel, Word

Input Bit Code:

Offset Binary

Maximum Linearity Error (EL):

0.0244 %

Nominal Settling Time (tstl):

20 ns

Maximum Supply Current:

90 mA

Sample Rate:

275 MHz

No. of Bits:

14

No. of Functions:

2

Electrical Specifications

Nominal Supply Voltage:

3.3 V

Minimum Analog Output Voltage:

-1 V

Maximum Analog Output Voltage:

1.25 V

Power Supplies:

3.3 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

2

Form Factor

No. of Terminals:

48

Terminal Form:

Terminal Position:

Quad

Terminal Pitch:

0.02 in (0.5 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.041 in (1.05 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Flatpack, Thin Profile, Fine Pitch

Package Code:

Package Equivalence Code:

TQFP48,.35SQ

Standards and Codes

Qualified:

No

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Trade Compliance

DAC5672AIPFBG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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