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CY74FCT573CTSOCTE4

Texas Instruments

CY74FCT573CTSOCTE4 by Texas Instruments

CY74FCT573CTSOCTE4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 4.7 ns at 5V, suitable for industrial applications. It features a 3-STATE output, operates b/w -40 to 85°C, and has a small outline package style for surface mount assembly.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 4,689 parts In-Stock

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Vyrian

USA . 1,920 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 77 parts In-Stock

1+ parts

$0.435

100+ parts

-

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$0.418

77

$0.435

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$0.418

Northwest PG Solutions

USA . 827 parts In-Stock

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$0.479

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-

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$0.422

827

$0.479

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$0.422

One Stop Electronics

USA . 1,081 parts In-Stock

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$3.000

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Andel Nordic

Denmark . 726 parts In-Stock

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$10.608

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$10.184

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$10.184

726

$10.608

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$10.184

$10.184

AZTECH Wire

Italy . 722 parts In-Stock

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$16.910

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722

$16.910

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Parana Technologies

USA . 505 parts In-Stock

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$17.570

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$1,631.676

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$15.813

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505

$17.570

$1,631.676

$15.813

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DigiPath Technology Company

USA . 233 parts In-Stock

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$19.347

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$17.799

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ChromeModa Solutions

Germany . 2,539 parts In-Stock

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$19.742

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$16.188

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IDEA Electronic Components Group

UK . 206 parts In-Stock

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$19.742

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$18.755

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$17.768

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$19.742

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$17.768

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Corphita

USA . 4,180 parts In-Stock

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Microchip USA

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Overview

Experience seamless data transmission and reliable performance with the CY74FCT573CTSOCTE4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality bus drivers & transceivers that are essential for various applications. This product offers customers unmatched value, efficiency, and versatility, making it the perfect choice for your electronic projects. Trust Texas Instruments to provide you with cutting-edge technology that meets all your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the bus driver & transceiver.

Propagation Delay At Nominal Supply: 4.7 ns

Low propagation delay ensures fast and efficient data transmission.

Surface Mount: YES

Allows for easy installation and integration into electronic circuits.

Package Shape: RECTANGULAR

Standard shape for easy handling and placement on circuit boards.

Nominal Supply Voltage / Vsup (V): 5

Standard voltage supply for compatibility with a wide range of systems.

Load Capacitance (CL): 50 pF

Optimal load capacitance for efficient signal transmission.

Power Supplies (V): 5

Consistent power supply ensures stable performance.

No. of Terminals: 20

Sufficient terminals for connecting to other components in the system.

Maximum I (ol): 64 Amp

High output current capability for driving multiple devices.

Propagation Delay (tpd): 5.5 ns

Low propagation delay for quick response time.

Maximum Operating Temperature: 85 °C

Wide operating temperature range for versatility in different environments.

Output Characteristics: 3-STATE

3-state output allows for flexibility in controlling connected devices.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold temperatures without malfunctioning.

Terminal Position: DUAL

Dual terminal position for easy connection and secure attachment to the PCB.

No. of Ports: 2

Two ports for connecting to multiple devices simultaneously.

Maximum Seated Height: 2.65 mm

Low profile design for space-constrained applications.

Width: 7.5 mm

Compact width for fitting into tight spaces on the circuit board.

Output Polarity: TRUE

True output polarity for accurate signal transmission.

Minimum Supply Voltage (Vsup): 4.75 V

Allows for operation at low voltage levels without loss of functionality.

Length: 12.8 mm

Optimal length for easy placement and routing on the PCB.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range for reliable operation in harsh conditions.

Technology: CMOS

Uses CMOS technology for low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminals for easy soldering and secure attachment to the PCB.

Packing Method: TR

TR packing method for convenient storage and handling during assembly.

Terminal Pitch: 1.27 mm

Standard terminal pitch for compatibility with common PCB layouts.

Maximum Supply Voltage (Vsup): 5.25 V

Allows for operation at higher voltage levels without risk of damage.

Technical Specifications

Bus Driver & Transceivers CY74FCT573CTSOCTE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

FCT

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

4.7 ns

Propagation Delay (tpd):

5.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

CY74FCT573CTSOCTE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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