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CY74FCT377CTSOCG4

Texas Instruments

CY74FCT377CTSOCG4 by Texas Instruments

CY74FCT377CTSOCG4 by Texas Instruments is an 8-bit latches & flip-flops IC with a propagation delay of 5.2 ns at 5V, suitable for industrial applications. It features a max frequency of 83.3 MHz, operates b/w -40 to 85°C, and has a small outline package style for surface mount assembly.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 8,242 parts In-Stock

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Digiode

USA . 204 parts In-Stock

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Native Components

USA . 106 parts In-Stock

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$1.099

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Northwest PG Solutions

USA . 658 parts In-Stock

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$1.209

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AZTECH Wire

Italy . 796 parts In-Stock

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$18.038

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Parana Technologies

USA . 842 parts In-Stock

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DigiPath Technology Company

USA . 2,058 parts In-Stock

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$23.483

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ChromeModa Solutions

Germany . 5,693 parts In-Stock

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$23.962

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$19.649

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IDEA Electronic Components Group

UK . 2,101 parts In-Stock

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$22.764

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$21.566

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One Stop Electronics

USA . 1,142 parts In-Stock

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Microchip USA

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Corphita

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Overview

Unlock endless possibilities with the CY74FCT377CTSOCG4 by Texas Instruments. Crafted with precision and expertise, this high-quality latch & flip-flop device offers unparalleled performance in a variety of applications. From industrial automation to consumer electronics, this product provides reliable operation and seamless functionality. Experience the value and benefits of Texas Instruments' cutting-edge technology with the CY74FCT377CTSOCG4, where quality meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ensuring longevity and ease of handling.

Propagation Delay At Nominal Supply: 5.2 ns

Low propagation delay ensures fast response times which is crucial in applications requiring quick switching.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and simplifying the assembly process.

No. of Bits: 8

8 bits provide sufficient capacity for handling a variety of data or signals efficiently.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage of 5V, making it compatible with common power sources.

Load Capacitance (CL): 50 pF

Optimal load capacitance ensures stable performance and reliability in various circuit configurations.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows for reliable operation even in harsh industrial environments.

Output Characteristics: 3-STATE

3-state output provides flexibility in controlling signal flow, allowing for efficient interfacing with other components.

Trigger Type: POSITIVE EDGE

Positive edge triggering ensures precise timing control, essential for synchronized operations in digital systems.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing efficiency and reliability.

Technical Specifications

Latches & Flip-Flops CY74FCT377CTSOCG4 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

FCT

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

83300000 Hz

Maximum I (ol):

64 Amp

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

5.2 ns

Propagation Delay (tpd):

5.2 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

7.5 mm

Trade Compliance

CY74FCT377CTSOCG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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