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CY74FCT2652CTQCTG4

Texas Instruments

CY74FCT2652CTQCTG4 by Texas Instruments

CY74FCT2652CTQCTG4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 5.4 ns at 5V, featuring a small outline package and dual terminal position. It operates in industrial temperatures from -40 to 85°C, suitable for bidirectional control applications requiring true output polarity and positive edge trigger type.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,276 parts In-Stock

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Digiode

USA . 109 parts In-Stock

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Andel Nordic

Denmark . 81 parts In-Stock

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$6.762

100+ parts

-

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$6.492

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$6.492

81

$6.762

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$6.492

$6.492

AZTECH Wire

Italy . 194 parts In-Stock

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$19.739

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Parana Technologies

USA . 1,625 parts In-Stock

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$23.776

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$24.406

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DigiPath Technology Company

USA . 1,684 parts In-Stock

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$26.181

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IDEA Electronic Components Group

UK . 1,647 parts In-Stock

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$26.715

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$25.379

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$24.044

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$25.379

$24.044

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ChromeModa Solutions

Germany . 343 parts In-Stock

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$26.715

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$21.906

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One Stop Electronics

USA . 504 parts In-Stock

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$62.000

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Corphita

USA . 3,025 parts In-Stock

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Northwest PG Solutions

USA . 2,140 parts In-Stock

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Microchip USA

USA . 379 parts In-Stock

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Native Components

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Overview

Experience seamless data transmission with the CY74FCT2652CTQCTG4 by Texas Instruments, a top-tier manufacturer known for its high-quality Bus Driver & Transceivers. This product offers lightning-fast propagation delay at just 5.4 ns, making it perfect for applications requiring quick response times. With its compact design and dual terminal position, this versatile device is ideal for a wide range of industrial settings. Trust in Texas Instruments to deliver reliable performance and unmatched value with the CY74FCT2652CTQCTG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product durable and resistant to harsh environmental conditions, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 5.4 ns

Low propagation delay ensures fast data transmission, making the product suitable for high-speed communication applications.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on PCBs, saving space and simplifying assembly processes.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V makes the product compatible with a wide range of electronic systems and power supplies.

Output Characteristics: 3-STATE WITH SERIES RESISTOR

The 3-state output with series resistor configuration provides better signal integrity, reducing the risk of signal distortion and ensuring reliable data transmission.

Minimum Operating Temperature: -40 °C

The product can operate efficiently in extreme low-temperature conditions, making it suitable for use in various industrial and outdoor environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy electrical environments.

Technical Specifications

Bus Driver & Transceivers CY74FCT2652CTQCTG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

INDEPENDENT CONTROL

Count Direction:

BIDIRECTIONAL

Family:

FCT

JESD-30 Code:

R-PDSO-G24

Length:

8.65 mm

Maximum I (ol):

12 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP24,.24

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

5.4 ns

Propagation Delay (tpd):

5.7 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Trade Compliance

CY74FCT2652CTQCTG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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