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CY74FCT138CTSOCG4

Texas Instruments

CY74FCT138CTSOCG4 by Texas Instruments

CY74FCT138CTSOCG4 by Texas Instruments is a 16-terminal decoder with 5ns propagation delay at 5V, suitable for industrial applications. It features inverted output polarity, CMOS technology, and operates b/w -40 to 85°C. The package is small outline with surface mount capability and standard input conditioning.

Median Price

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1k+

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Vyrian

USA . 6,541 parts In-Stock

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Digiode

USA . 3,222 parts In-Stock

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Native Components

USA . 367 parts In-Stock

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$0.466

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$0.447

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Northwest PG Solutions

USA . 1,792 parts In-Stock

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$0.513

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$0.452

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AZTECH Wire

Italy . 703 parts In-Stock

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$5.414

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Parana Technologies

USA . 2,089 parts In-Stock

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$18.129

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DigiPath Technology Company

USA . 1,480 parts In-Stock

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$19.782

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$18.200

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ChromeModa Solutions

Germany . 3,530 parts In-Stock

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$20.186

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IDEA Electronic Components Group

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One Stop Electronics

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Overview

Unlock the power of advanced decoding and driving capabilities with the CY74FCT138CTSOCG4 by Texas Instruments. Crafted with precision and expertise, this decoder & driver offers unparalleled performance and reliability for a wide range of applications. With a nominal supply voltage of 5V and a propagation delay of just 5ns, this product delivers fast and efficient operation. Experience seamless integration and enhanced functionality thanks to its inverted output polarity and standard input conditioning. Trust in Texas Instruments to provide top-quality solutions that exceed expectations. Elevate your projects with the CY74FCT138CTSOCG4 - the ultimate choice for superior performance and value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Propagation Delay At Nominal Supply: 5 ns

With a fast propagation delay of 5 ns at nominal supply, this decoder and driver ensure quick signal processing and response times.

Surface Mount: YES

Being surface mountable allows for easy and efficient integration into electronic circuit boards, saving space and simplifying assembly.

Input Conditioning: STANDARD

Standard input conditioning ensures compatibility with a wide range of input signals, making it versatile for different use cases.

Package Shape: RECTANGULAR

The rectangular package shape offers a compact design, making it easier to fit into tight spaces within electronic devices.

Nominal Supply Voltage / Vsup: 5V

With a nominal supply voltage of 5V, this decoder and driver can be easily powered using a common voltage source.

Load Capacitance (CL): 50 pF

The load capacitance of 50 pF ensures stable operation and efficient performance in driving connected loads.

Power Supplies (V): 5V

The compatibility with 5V power supplies ensures easy integration into existing electronic systems without the need for additional power sources.

No. of Terminals: 16

Having 16 terminals provides ample connectivity options for interfacing with other components and devices in the circuit.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board and allows for a higher density of components in the system.

Maximum I (ol): 64 Amp

The maximum output current of 64 Amp allows for driving high-power loads with ease, making it suitable for demanding applications.

Propagation Delay (tpd): 5 ns

The low propagation delay of 5 ns ensures minimal delay in signal transmission, improving the overall performance of the circuit.

Maximum Operating Temperature: 85°C

With a maximum operating temperature of 85°C, this product can withstand high temperatures, making it suitable for industrial environments.

Minimum Operating Temperature: -40°C

The ability to operate at temperatures as low as -40°C ensures reliable performance in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: DUAL

The dual terminal position offers flexibility in mounting options, allowing for versatile installation in different configurations.

Maximum Seated Height: 2.65 mm

The low maximum seated height of 2.65 mm helps in reducing the overall profile of the device, making it suitable for compact designs.

Width: 7.5 mm

The compact width of 7.5 mm allows for efficient use of space on the circuit board, enabling a more streamlined layout.

Output Polarity: INVERTED

The inverted output polarity allows for compatibility with systems that require inverted logic levels, expanding its range of applications.

Minimum Supply Voltage (Vsup): 4.75V

The ability to function at a minimum supply voltage of 4.75V ensures reliable operation even under fluctuating voltage conditions.

Maximum Time At Peak Reflow Temperature (s): 30s

The product can withstand peak reflow temperatures for up to 30 seconds, making it easy to integrate during the manufacturing process.

Peak Reflow Temperature °C: 260°C

With a peak reflow temperature of 260°C, this product is suitable for lead-free soldering processes, ensuring compliance with industry standards.

Length: 10.3 mm

The compact length of 10.3 mm helps in saving space on the circuit board and allows for a more efficient layout of components.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environments with extreme temperature variations.

Technology: CMOS

The CMOS technology used in this product offers low power consumption and high noise immunity, enhancing overall performance.

Terminal Form: GULL WING

The gull wing terminal form provides secure and reliable solder connections, ensuring long-term stability in the circuit.

Packing Method: TUBE

The tube packing method offers convenient storage and handling, providing protection during transportation and storage.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27 mm allows for easy and precise soldering, facilitating quick and efficient assembly of the device.

Maximum Supply Voltage (Vsup): 5.25V

With a maximum supply voltage of 5.25V, the product can withstand voltage fluctuations without compromising performance or reliability.

Technical Specifications

Decoder & Drivers CY74FCT138CTSOCG4 attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Additional Features:

3 ENABLE INPUTS

Family:

FCT

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

5 ns

Propagation Delay (tpd):

5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

CY74FCT138CTSOCG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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