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CY74FCT138CTQCTG4

Texas Instruments

CY74FCT138CTQCTG4 by Texas Instruments

CY74FCT138CTQCTG4 by Texas Instruments is a 16-terminal decoder with 5ns propagation delay at 5V, suitable for industrial applications. It features inverted output polarity, standard input conditioning, and operates within -40 to 85°C temperature range. This CMOS technology device has a small outline package style and is surface mountable.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,369 parts In-Stock

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Digiode

USA . 758 parts In-Stock

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758

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Native Components

USA . 405 parts In-Stock

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$1.736

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405

$1.736

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Northwest PG Solutions

USA . 2,270 parts In-Stock

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$1.909

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AZTECH Wire

Italy . 775 parts In-Stock

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$5.535

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$5.535

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Parana Technologies

USA . 463 parts In-Stock

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$11.940

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$12.347

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463

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$12.347

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DigiPath Technology Company

USA . 471 parts In-Stock

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$13.148

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471

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ChromeModa Solutions

Germany . 2,107 parts In-Stock

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$13.416

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$11.001

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IDEA Electronic Components Group

UK . 236 parts In-Stock

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$13.416

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$12.745

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$12.074

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One Stop Electronics

USA . 395 parts In-Stock

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$57.000

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Corphita

USA . 1,246 parts In-Stock

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Overview

Discover the top-notch quality and reliability of the CY74FCT138CTQCTG4 by Texas Instruments, a leading manufacturer in the semiconductor industry. This innovative Decoder & Driver offers fast propagation delay and inverted output polarity, making it ideal for various applications. With a compact package design and standard input conditioning, this product delivers exceptional performance and efficiency. Trust Texas Instruments to provide you with cutting-edge technology that meets your needs and exceeds your expectations. Upgrade your projects with the CY74FCT138CTQCTG4 and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the decoder & drivers, ensuring a longer product lifespan.

Propagation Delay At Nominal Supply: 5 ns

Low propagation delay ensures quick response and efficient operation of the decoder & drivers, making it ideal for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and reducing assembly time.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage makes it compatible with a wide range of electronic systems and applications.

Output Polarity: INVERTED

Inverted output polarity provides flexibility in signal processing and compatibility with various input/output configurations.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the decoder & drivers energy-efficient and reliable.

Technical Specifications

Decoder & Drivers CY74FCT138CTQCTG4 attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Additional Features:

3 ENABLE INPUTS

Family:

FCT

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

4.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

5 ns

Propagation Delay (tpd):

5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

CY74FCT138CTQCTG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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