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CDCVF855PWRG4

Texas Instruments

CDCVF855PWRG4 by Texas Instruments

CDCVF855PWRG4 clock driver by Texas Instruments operates at 2.5V with 28 terminals and a load capacitance of 14pF. It features a propagation delay of 3.5ns, output characteristics in 3-STATE, and is ideal for industrial applications requiring differential input conditioning and a peak reflow temperature of 260°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,532 parts In-Stock

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3,532

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Digiode

USA . 1,608 parts In-Stock

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1,608

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,643 parts In-Stock

1+ parts

$7.854

100+ parts

-

1k+ parts

$8.410

10k+ parts

-

1,643

$7.854

-

$8.410

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DigiPath Technology Company

USA . 902 parts In-Stock

1+ parts

$8.648

100+ parts

-

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-

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902

$8.648

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ChromeModa Solutions

Germany . 2,607 parts In-Stock

1+ parts

$8.825

100+ parts

$7.236

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-

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2,607

$8.825

$7.236

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IDEA Electronic Components Group

UK . 982 parts In-Stock

1+ parts

$8.825

100+ parts

$8.384

1k+ parts

$7.942

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-

982

$8.825

$8.384

$7.942

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Andel Nordic

Denmark . 4,576 parts In-Stock

1+ parts

$8.864

100+ parts

-

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$8.510

10k+ parts

$8.510

4,576

$8.864

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$8.510

$8.510

One Stop Electronics

USA . 1,162 parts In-Stock

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$17.000

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1,162

$17.000

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Corohmni

South Africa . 250 parts In-Stock

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$18.909

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250

$18.909

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AZTECH Wire

Italy . 283 parts In-Stock

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$19.092

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283

$19.092

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$30.889

100+ parts

$28.109

1k+ parts

$25.329

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5,000

$30.889

$28.109

$25.329

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Microchip USA

USA . 11,169 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,041 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,027 parts In-Stock

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Corphita

USA . 2,472 parts In-Stock

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2,472

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Northwest PG Solutions

USA . 1,409 parts In-Stock

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$3.638

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1,409

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$3.638

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Native Components

USA . 36 parts In-Stock

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$3.601

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36

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$3.601

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Overview

Elevate your electronic designs with the CDCVF855PWRG4 clock driver and buffer by Texas Instruments. Crafted with precision and quality in mind, this essential component offers unparalleled reliability and performance. Ideal for a variety of applications, including telecommunications and industrial equipment, this small yet powerful device ensures seamless synchronization and efficient signal distribution. Experience the value of superior design and innovation with the CDCVF855PWRG4, delivering unmatched benefits and advantages to customers seeking top-tier solutions for their projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a long lifespan for the product.

Surface Mount: YES

Enables easy installation and space-saving design, suitable for modern PCB layouts.

Input Conditioning: DIFFERENTIAL

Offers improved signal integrity and noise rejection for reliable clock signal transmission.

Propagation Delay (tpd): 3.5 ns

Provides fast signal propagation, ensuring accurate timing synchronization in clock distribution systems.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications with reliable performance under high temperature environments.

Maximum Power Supply Current (ICC): 10 mA

Low power consumption, making it energy-efficient and cost-effective in operation.

Technical Specifications

Clock Drivers & Buffers CDCVF855PWRG4 attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

855

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

9.7 mm

Load Capacitance (CL):

14 pF

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

28

No. of True Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5

Maximum Power Supply Current (ICC):

10 mA

Propagation Delay (tpd):

3.5 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.04 ns

Maximum Seated Height:

1.2 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

2.7 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Minimum fmax:

220 MHz

Trade Compliance

CDCVF855PWRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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