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CDCVF25081PWRG4

Texas Instruments

CDCVF25081PWRG4 by Texas Instruments

Texas Instruments CDCVF25081PWRG4 is a clock driver with 6ns propagation delay at 3.3V, suitable for industrial applications. It features 8 true outputs, operates b/w -40 to 85°C, and has a load capacitance of 25pF. The package is small outline with dual gull wing terminals for surface mount assembly.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,444 parts In-Stock

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2,444

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Digiode

USA . 742 parts In-Stock

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742

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Distributors (Availability)

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AZTECH Wire

Italy . 686 parts In-Stock

1+ parts

$7.041

100+ parts

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686

$7.041

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Andel Nordic

Denmark . 1,893 parts In-Stock

1+ parts

$7.716

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-

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$7.408

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$7.408

1,893

$7.716

-

$7.408

$7.408

Parana Technologies

USA . 494 parts In-Stock

1+ parts

$24.322

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-

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$24.984

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494

$24.322

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$24.984

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DigiPath Technology Company

USA . 1,616 parts In-Stock

1+ parts

$26.781

100+ parts

$24.639

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1,616

$26.781

$24.639

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ChromeModa Solutions

Germany . 2,599 parts In-Stock

1+ parts

$27.328

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$22.409

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$27.328

$22.409

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IDEA Electronic Components Group

UK . 41 parts In-Stock

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$27.328

100+ parts

$25.962

1k+ parts

$24.595

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41

$27.328

$25.962

$24.595

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One Stop Electronics

USA . 1,098 parts In-Stock

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$35.000

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1,098

$35.000

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Native Components

USA . 938 parts In-Stock

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$158.857

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$152.503

938

$158.857

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$152.503

Northwest PG Solutions

USA . 1,341 parts In-Stock

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$174.743

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1,341

$174.743

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A-Z Elektronik GmbH

Germany . 5,040 parts In-Stock

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,360 parts In-Stock

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Microchip USA

USA . 2,985 parts In-Stock

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Kepictronics

USA . 1,050 parts In-Stock

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Corphita

USA . 149 parts In-Stock

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Overview

Enhance the performance of your electronic devices with the CDCVF25081PWRG4 by Texas Instruments. As a trusted manufacturer in the industry, Texas Instruments delivers top-quality clock drivers & buffers that guarantee reliability and precision. Perfect for a wide range of applications, this product offers fast propagation delay, 3-state output characteristics, and a compact design for easy installation. Elevate your projects with the CDCVF25081PWRG4 and experience seamless operation, improved efficiency, and exceptional value. Upgrade to Texas Instruments today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides durability and reliability to the product, making it suitable for various applications.

Propagation Delay At Nominal Supply: 6 ns

With a low propagation delay of 6 ns at nominal supply, this product ensures fast and efficient signal transmission, ideal for time-sensitive applications.

Surface Mount: YES

The surface mount capability of this product makes it easy to integrate into PCB designs, saving space and simplifying assembly processes.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V, this product is compatible with a wide range of electronic systems and ensures efficient power consumption.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can withstand high thermal conditions, making it suitable for industrial applications.

Technical Specifications

Clock Drivers & Buffers CDCVF25081PWRG4 attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

25081

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

25 pF

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6 ns

Propagation Delay (tpd):

6 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.15 ns

Maximum Seated Height:

1.2 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Minimum fmax:

200 MHz

Trade Compliance

CDCVF25081PWRG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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