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CDCV857ADGGG4

Texas Instruments

CDCV857ADGGG4 by Texas Instruments

PLL BASED CLOCK DRIVER; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR;

Median Price

$5.390

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 7 parts In-Stock

1+ parts

-

100+ parts

$5.390

1k+ parts

$4.820

10k+ parts

$4.540

7

-

$5.390

$4.820

$4.540

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 658 parts In-Stock

1+ parts

$4.940

100+ parts

-

1k+ parts

-

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-

658

$4.940

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-

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Vyrian

USA . 6,073 parts In-Stock

1+ parts

-

100+ parts

-

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6,073

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Zilex Electronics Inc.

Canada . 40 parts In-Stock

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40

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 514 parts In-Stock

1+ parts

$1.080

100+ parts

-

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-

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514

$1.080

-

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Northwest PG Solutions

USA . 959 parts In-Stock

1+ parts

$1.188

100+ parts

-

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959

$1.188

-

-

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Andel Nordic

Denmark . 1,542 parts In-Stock

1+ parts

$3.914

100+ parts

-

1k+ parts

$3.758

10k+ parts

$3.758

1,542

$3.914

-

$3.758

$3.758

Ampacity Inc.

Singapore . 7 parts In-Stock

1+ parts

$4.420

100+ parts

-

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-

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-

7

$4.420

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Corphita

USA . 1,883 parts In-Stock

1+ parts

$4.680

100+ parts

-

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1,883

$4.680

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Component Stockers USA

USA . 5 parts In-Stock

1+ parts

$5.350

100+ parts

-

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5

$5.350

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AZTECH Wire

Italy . 296 parts In-Stock

1+ parts

$19.740

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296

$19.740

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Parana Technologies

USA . 204 parts In-Stock

1+ parts

$28.013

100+ parts

-

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$42.726

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204

$28.013

-

$42.726

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DigiPath Technology Company

USA . 2,238 parts In-Stock

1+ parts

$30.846

100+ parts

$28.378

1k+ parts

-

10k+ parts

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2,238

$30.846

$28.378

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ChromeModa Solutions

Germany . 2,038 parts In-Stock

1+ parts

$31.475

100+ parts

$25.810

1k+ parts

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2,038

$31.475

$25.810

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IDEA Electronic Components Group

UK . 43 parts In-Stock

1+ parts

$31.475

100+ parts

$29.901

1k+ parts

$28.328

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43

$31.475

$29.901

$28.328

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Microchip USA

USA . 1,559 parts In-Stock

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1,559

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Technical Specifications

Clock Drivers & Buffers CDCV857ADGGG4 attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

857

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Load Capacitance (CL):

14 pF

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

48

No. of True Outputs:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5

Maximum Power Supply Current (ICC):

12 mA

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.075 ns

Maximum Seated Height:

1.2 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

2.7 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6.1 mm

Minimum fmax:

180 MHz

Trade Compliance

CDCV857ADGGG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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