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CDCU877RHATG4

Texas Instruments

CDCU877RHATG4 by Texas Instruments

The Texas Instruments CDCU877RHATG4 clock driver features 40 terminals, operates at a supply voltage of 1.8V, and has a max output current of 9A. Ideal for industrial applications requiring differential input conditioning and a min operating temperature of -40°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,568 parts In-Stock

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4,568

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Vyrian

USA . 4,169 parts In-Stock

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4,169

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 3,444 parts In-Stock

1+ parts

$3.239

100+ parts

-

1k+ parts

$3.110

10k+ parts

$3.110

3,444

$3.239

-

$3.110

$3.110

AZTECH Wire

Italy . 763 parts In-Stock

1+ parts

$11.836

100+ parts

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763

$11.836

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Parana Technologies

USA . 1,871 parts In-Stock

1+ parts

$21.402

100+ parts

-

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$21.748

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1,871

$21.402

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$21.748

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DigiPath Technology Company

USA . 40 parts In-Stock

1+ parts

$23.566

100+ parts

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40

$23.566

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ChromeModa Solutions

Germany . 5,437 parts In-Stock

1+ parts

$24.047

100+ parts

$19.719

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5,437

$24.047

$19.719

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IDEA Electronic Components Group

UK . 2,130 parts In-Stock

1+ parts

$24.047

100+ parts

$22.845

1k+ parts

$21.642

10k+ parts

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2,130

$24.047

$22.845

$21.642

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One Stop Electronics

USA . 165 parts In-Stock

1+ parts

$48.000

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165

$48.000

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Native Components

USA . 521 parts In-Stock

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$120.650

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$115.824

521

$120.650

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$115.824

Northwest PG Solutions

USA . 734 parts In-Stock

1+ parts

$132.715

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734

$132.715

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Microchip USA

USA . 2,550 parts In-Stock

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2,550

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Corphita

USA . 611 parts In-Stock

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611

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Overview

Enhance your electronic projects with the Texas Instruments CDCU877RHATG4 clock driver and buffer. With a reputation for quality and reliability, Texas Instruments delivers cutting-edge solutions for a variety of applications. This versatile chip carrier offers differential input conditioning and three-state output characteristics, making it ideal for industrial use. Experience the benefits of its compact design, low power consumption, and high-speed performance. Trust Texas Instruments to provide the innovative technology you need for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for the package body

Surface Mount: YES

Allows for easy and efficient soldering onto PCBs

Input Conditioning: DIFFERENTIAL

Enhances signal quality and reduces noise interference

Package Shape: SQUARE

Optimal form factor for efficient board layout and space utilization

Nominal Supply Voltage / Vsup (V): 1.8

Operates at a common and standard supply voltage

Power Supplies (V): 1.8

Consistent power delivery for reliable performance

No. of Terminals: 40

Provides multiple connection points for versatility in circuit design

Maximum I (ol): 9 Amp

High output current capacity for driving multiple loads

Maximum Operating Temperature: 85 °C

Suitable for industrial environments with high temperature conditions

Output Characteristics: 3-STATE

Allows for tri-state output control for added flexibility

Minimum Operating Temperature: -40 °C

Can operate in cold temperature environments as well

Terminal Finish: NICKEL PALLADIUM GOLD

Corrosion-resistant finish for long-lasting performance

Width: 6 mm

Compact size for space-constrained applications

Minimum Supply Voltage (Vsup): 1.7 V

Tolerant to lower supply voltages for reliable operation

Peak Reflow Temperature °C: 260

Can withstand high-temperature soldering processes

Temperature Grade: INDUSTRIAL

Designed for rugged industrial environments

Terminal Form: NO LEAD

Lead-free terminals for environmental compliance

Terminal Pitch: 0.5 mm

Fine pitch for compact layout and high-density integration

No. of True Outputs: 10

Multiple true output channels for diverse signal routing

Minimum fmax: 340 MHz

High maximum frequency for fast signal processing

Moisture Sensitivity Level (MSL): 3

Suitable for standard industrial moisture exposure levels

Maximum Supply Voltage (Vsup): 1.9 V

Safe operating voltage limit to prevent overvoltage damage

Technical Specifications

Clock Drivers & Buffers CDCU877RHATG4 attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

877

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Logic IC Type:

Maximum I (ol):

9 Amp

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

40

No. of True Outputs:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.035 ns

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

1.9 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Minimum fmax:

340 MHz

Trade Compliance

CDCU877RHATG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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