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CDCU877BZQLR

Texas Instruments

CDCU877BZQLR by Texas Instruments

The Texas Instruments CDCU877BZQLR clock driver features 52 terminals, operates at a supply voltage of 1.8V, and has a max operating temperature of 85°C. It is designed for industrial applications requiring differential input conditioning and offers a max fmax of 340MHz with 10 true outputs in a compact rectangular package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,976 parts In-Stock

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Digiode

USA . 1,297 parts In-Stock

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1,297

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Distributors (Availability)

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Andel Nordic

Denmark . 521 parts In-Stock

1+ parts

$5.629

100+ parts

-

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$5.404

10k+ parts

$5.404

521

$5.629

-

$5.404

$5.404

Parana Technologies

USA . 1,792 parts In-Stock

1+ parts

$9.802

100+ parts

-

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$10.372

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1,792

$9.802

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$10.372

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DigiPath Technology Company

USA . 487 parts In-Stock

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$10.793

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$9.929

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487

$10.793

$9.929

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ChromeModa Solutions

Germany . 6,502 parts In-Stock

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$11.013

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$9.031

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6,502

$11.013

$9.031

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IDEA Electronic Components Group

UK . 1,847 parts In-Stock

1+ parts

$11.013

100+ parts

$10.462

1k+ parts

$9.912

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1,847

$11.013

$10.462

$9.912

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AZTECH Wire

Italy . 363 parts In-Stock

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$13.112

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363

$13.112

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One Stop Electronics

USA . 1,598 parts In-Stock

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$42.000

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1,598

$42.000

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Native Components

USA . 798 parts In-Stock

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$191.155

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$183.509

798

$191.155

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$183.509

Northwest PG Solutions

USA . 663 parts In-Stock

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$210.270

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663

$210.270

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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Corphita

USA . 1,417 parts In-Stock

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Microchip USA

USA . 128 parts In-Stock

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128

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Overview

Experience the superior quality and reliability of Texas Instruments with the CDCU877BZQLR clock driver & buffer. This innovative product offers unparalleled performance in a wide range of applications, providing customers with precise timing solutions. With a focus on value and efficiency, this device delivers exceptional benefits to users looking for top-notch clock drivers. Trust Texas Instruments to power your projects with cutting-edge technology and unmatched expertise in the industry. Elevate your designs with the CDCU877BZQLR and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the clock driver, ensuring a longer lifespan.

Surface Mount: YES

Makes installation easier and more efficient compared to through-hole mounting, saving time and effort during assembly.

Input Conditioning: DIFFERENTIAL

Allows for accurate and reliable data transmission, reducing signal interference and improving overall performance.

Nominal Supply Voltage / Vsup (V): 1.8

Provides a stable power source for the clock driver, ensuring consistent operation without voltage fluctuations.

Maximum I (ol): 9 Amp

High output current capability allows the clock driver to drive multiple components effectively, making it suitable for complex systems.

Maximum Operating Temperature: 85 °C

Can operate effectively in high temperature environments, ensuring reliable performance in a variety of conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the clock driver energy-efficient and reliable in noisy environments.

Technical Specifications

Clock Drivers & Buffers CDCU877BZQLR attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

877

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

R-PBGA-B52

Length:

7 mm

Logic IC Type:

Maximum I (ol):

9 Amp

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

52

No. of True Outputs:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA52,6X10,25

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.8

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.025 ns

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

1.9 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.5 mm

Minimum fmax:

340 MHz

Trade Compliance

CDCU877BZQLR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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