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CDCLVP110VFG4

Texas Instruments

CDCLVP110VFG4 by Texas Instruments

CDCLVP110VFG4 by Texas Instruments is a clock driver with 0.37 ns propagation delay, 2.5V nominal voltage, and 10 true outputs. It is used in applications requiring differential mux input conditioning, operates at industrial temperature grade, and has a max power supply current of 380 mA.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,779 parts In-Stock

1+ parts

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3,779

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Vyrian

USA . 3,504 parts In-Stock

1+ parts

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3,504

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 564 parts In-Stock

1+ parts

$1.690

100+ parts

-

1k+ parts

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10k+ parts

-

564

$1.690

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Northwest PG Solutions

USA . 10 parts In-Stock

1+ parts

$1.859

100+ parts

-

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10

$1.859

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Andel Nordic

Denmark . 2,210 parts In-Stock

1+ parts

$5.769

100+ parts

-

1k+ parts

$5.538

10k+ parts

$5.538

2,210

$5.769

-

$5.538

$5.538

Parana Technologies

USA . 1,219 parts In-Stock

1+ parts

$12.262

100+ parts

-

1k+ parts

$12.685

10k+ parts

-

1,219

$12.262

-

$12.685

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DigiPath Technology Company

USA . 1,298 parts In-Stock

1+ parts

$13.501

100+ parts

$12.421

1k+ parts

-

10k+ parts

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1,298

$13.501

$12.421

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ChromeModa Solutions

Germany . 6,572 parts In-Stock

1+ parts

$13.777

100+ parts

$11.297

1k+ parts

-

10k+ parts

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6,572

$13.777

$11.297

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IDEA Electronic Components Group

UK . 2,097 parts In-Stock

1+ parts

$13.777

100+ parts

$13.088

1k+ parts

$12.399

10k+ parts

-

2,097

$13.777

$13.088

$12.399

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AZTECH Wire

Italy . 270 parts In-Stock

1+ parts

$15.494

100+ parts

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270

$15.494

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One Stop Electronics

USA . 1,507 parts In-Stock

1+ parts

$24.000

100+ parts

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1,507

$24.000

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Corphita

USA . 1,634 parts In-Stock

1+ parts

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1,634

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Microchip USA

USA . 1,017 parts In-Stock

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1,017

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Assy Fe

Spain . 1,000 parts In-Stock

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1,000

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Overview

Enhance the precision and efficiency of your electronic devices with the CDCLVP110VFG4 by Texas Instruments. Crafted with superior quality materials and cutting-edge technology, this clock driver and buffer ensures optimal performance in a wide range of applications. With fast propagation delay and multiple power supply options, this product offers unmatched reliability and flexibility. Elevate your projects with the trusted manufacturer and experience seamless integration, improved functionality, and enhanced overall value. Choose Texas Instruments for innovative solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage during handling or installation.

Propagation Delay At Nominal Supply: 0.37 ns

With such a low propagation delay, this clock driver ensures efficient and fast signal transmission, making it ideal for high-performance applications.

Surface Mount: YES

Surface mount capability allows for easy and compact integration onto circuit boards, saving space and simplifying the overall design.

Nominal Supply Voltage / Vsup (V): 2.5

The 2.5V supply voltage ensures compatibility with a wide range of systems and components, enhancing versatility and ease of integration.

Maximum I (ol): 5 Amp

The high output current capability of 5 Amps ensures that the clock driver can drive multiple loads or higher-power components without issues, making it a reliable choice for demanding applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this clock driver can handle high-temperature environments, ensuring reliable performance in various operating conditions.

Minimum Operating Temperature: -40 °C

The clock driver can operate in extremely low temperatures down to -40°C, making it suitable for a wide range of industrial and environmental conditions.

Maximum Power Supply Current (ICC): 380 mA

The low power supply current requirement of 380mA ensures energy-efficient operation, reducing power consumption and heat generation in the system.

Technical Specifications

Clock Drivers & Buffers CDCLVP110VFG4 attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Additional Features:

LVECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.8V; ALSO OPERATES AT 3.3 V SUPPLY

Family:

110

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e4

Length:

7 mm

Logic IC Type:

Maximum I (ol):

5 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

32

No. of True Outputs:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Packing Method:

TRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

-2.5/-3.3/2.5/3.3

Maximum Power Supply Current (ICC):

380 mA

Propagation Delay At Nominal Supply:

.37 ns

Propagation Delay (tpd):

.37 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.03 ns

Maximum Seated Height:

1.6 mm

Sub-Category:

Clock Driver

Maximum Supply Voltage (Vsup):

3.8 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Minimum fmax:

3500 MHz

Trade Compliance

CDCLVP110VFG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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