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CDC857-2DGG

Texas Instruments

CDC857-2DGG by Texas Instruments

The Texas Instruments CDC857-2DGG clock driver features 48 terminals, 6 ns propagation delay, and 12 Amp max I (ol). It is used in applications requiring differential input conditioning and 3-STATE output characteristics. The package style is small outline with a thin profile, making it suitable for compact designs.

Median Price

$13.730

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 16,220 parts In-Stock

1+ parts

-

100+ parts

$13.730

1k+ parts

-

10k+ parts

-

16,220

-

$13.730

-

-

Rochester

USA . 10,460 parts In-Stock

1+ parts

-

100+ parts

$11.880

1k+ parts

$10.630

10k+ parts

$10.000

10,460

-

$11.880

$10.630

$10.000

Verical

USA . 1,400 parts In-Stock

1+ parts

-

100+ parts

$14.850

1k+ parts

$13.287

10k+ parts

$12.500

1,400

-

$14.850

$13.287

$12.500

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,267 parts In-Stock

1+ parts

$12.540

100+ parts

-

1k+ parts

-

10k+ parts

-

2,267

$12.540

-

-

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Vyrian

USA . 1,098 parts In-Stock

1+ parts

$13.200

100+ parts

-

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-

10k+ parts

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1,098

$13.200

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-

-

DigiKey Marketplace

USA . 16,220 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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16,220

-

-

-

-

Bristol Electronics

USA . 1,109 parts In-Stock

1+ parts

-

100+ parts

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1,109

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-

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Prism Electronics

USA . 5 parts In-Stock

1+ parts

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5

-

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First Choice Components Inc.

USA . 4 parts In-Stock

1+ parts

-

100+ parts

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4

-

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 5,780 parts In-Stock

1+ parts

$2.918

100+ parts

-

1k+ parts

$2.801

10k+ parts

$2.801

5,780

$2.918

-

$2.801

$2.801

Corphita

USA . 1,075 parts In-Stock

1+ parts

$11.880

100+ parts

-

1k+ parts

-

10k+ parts

-

1,075

$11.880

-

-

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Native Components

USA . 679 parts In-Stock

1+ parts

$12.045

100+ parts

-

1k+ parts

-

10k+ parts

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679

$12.045

-

-

-

Northwest PG Solutions

USA . 1,420 parts In-Stock

1+ parts

$13.250

100+ parts

$11.925

1k+ parts

-

10k+ parts

-

1,420

$13.250

$11.925

-

-

Parana Technologies

USA . 2,125 parts In-Stock

1+ parts

$16.789

100+ parts

-

1k+ parts

$17.036

10k+ parts

-

2,125

$16.789

-

$17.036

-

DigiPath Technology Company

USA . 299 parts In-Stock

1+ parts

$18.487

100+ parts

$17.008

1k+ parts

-

10k+ parts

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299

$18.487

$17.008

-

-

ChromeModa Solutions

Germany . 5,743 parts In-Stock

1+ parts

$18.864

100+ parts

$15.468

1k+ parts

-

10k+ parts

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5,743

$18.864

$15.468

-

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IDEA Electronic Components Group

UK . 2,312 parts In-Stock

1+ parts

$18.864

100+ parts

$17.921

1k+ parts

$16.978

10k+ parts

-

2,312

$18.864

$17.921

$16.978

-

A-Z Elektronik GmbH

Germany . 6,237 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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6,237

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-

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Alle Elektronik GmbH

Germany . 4,158 parts In-Stock

1+ parts

-

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4,158

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Microchip USA

USA . 239 parts In-Stock

1+ parts

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239

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Assy Fe

Spain . 6 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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6

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-

Overview

Enhance your electronics projects with the CDC857-2DGG clock driver & buffer from Texas Instruments, a leader in innovative semiconductor solutions. This versatile component is designed for precision timing applications, offering reliable performance and seamless integration. With 10 true outputs and a low propagation delay of just 6ns, this compact device delivers exceptional efficiency and accuracy. Upgrade your designs with the quality and value that only Texas Instruments can provide. Elevate your creations to new heights with the CDC857-2DGG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Surface Mount: YES

The surface mount feature allows for easy installation and space-saving on PCBs.

Input Conditioning: DIFFERENTIAL

Differential input conditioning helps in reducing noise and improving signal integrity.

Nominal Supply Voltage / Vsup (V): 2.5

The 2.5 V supply voltage is common in many electronic devices, making this product compatible with a wide range of applications.

Propogation Delay (tpd): 6 ns

The low propagation delay of 6 ns ensures fast and efficient signal processing.

Output Characteristics: 3-STATE

The 3-STATE output allows for tristate outputs, providing flexibility in controlling the output signal.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliability in varying environmental conditions.

Technical Specifications

Clock Drivers & Buffers CDC857-2DGG attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

48

No. of True Outputs:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5

Propagation Delay (tpd):

6 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.1 ns

Maximum Seated Height:

1.2 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

2.7 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6.1 mm

Trade Compliance

CDC857-2DGG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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