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CDC857-3DGGRG4

Texas Instruments

CDC857-3DGGRG4 by Texas Instruments

CDC857-3DGGRG4 clock driver by Texas Instruments features a 48-terminal package with power supplies of 2.5V and 3.3V. It operates b/w temperatures of 0°C to 85°C, with a max output current of 12A. This device is commonly used in applications requiring precise clock signal distribution in electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,131 parts In-Stock

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6,131

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Digiode

USA . 4,538 parts In-Stock

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4,538

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Distributors (Availability)

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Northwest PG Solutions

USA . 1,283 parts In-Stock

1+ parts

$3.347

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-

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1,283

$3.347

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Andel Nordic

Denmark . 177 parts In-Stock

1+ parts

$6.613

100+ parts

-

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$6.348

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$6.348

177

$6.613

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$6.348

$6.348

AZTECH Wire

Italy . 703 parts In-Stock

1+ parts

$8.068

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703

$8.068

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One Stop Electronics

USA . 184 parts In-Stock

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$15.000

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184

$15.000

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Parana Technologies

USA . 1,466 parts In-Stock

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$24.451

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$25.119

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1,466

$24.451

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$25.119

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DigiPath Technology Company

USA . 2,141 parts In-Stock

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$26.924

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2,141

$26.924

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ChromeModa Solutions

Germany . 4,303 parts In-Stock

1+ parts

$27.473

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$22.528

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4,303

$27.473

$22.528

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IDEA Electronic Components Group

UK . 2,130 parts In-Stock

1+ parts

$27.473

100+ parts

$26.099

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$24.726

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2,130

$27.473

$26.099

$24.726

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Corphita

USA . 3,569 parts In-Stock

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3,569

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Native Components

USA . 732 parts In-Stock

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$2.951

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732

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$2.951

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Overview

Elevate your electronic designs with the CDC857-3DGGRG4 clock driver by Texas Instruments. Known for their high-quality components, Texas Instruments delivers exceptional performance and reliability in every product. Clock Drivers & Buffers are essential for precision timing in a wide range of applications, and this model offers superior value, benefits, and advantages to customers looking for seamless integration and optimal performance. Upgrade your projects with the CDC857-3DGGRG4 and experience the difference Texas Instruments can make in your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes this product lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Being surface mountable allows for easy assembly onto PCBs, saving space and enabling automated manufacturing processes.

Power Supplies (V): 2.5, 3.3

Compatible with multiple power supply voltages, providing flexibility in design and compatibility with different systems.

No. of Terminals: 48

With a high number of terminals, this product can support complex clock driver and buffering functionalities, offering versatility in circuit design.

Maximum I (ol): 12 Amp

The high output current capability of 12 Amp allows this product to drive multiple clock loads or buffers effectively, ensuring reliable performance.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can withstand high temperature environments, suitable for a wide range of applications.

Minimum Operating Temperature: 0 °C

The ability to operate at a minimum temperature of 0°C ensures reliability and performance even in low temperature conditions.

Terminal Position: DUAL

Dual terminal position provides stability and reliability in the connection, reducing the risk of signal loss or interference.

Terminal Form: GULL WING

The gull wing terminal form allows for easy soldering and secure attachment to the PCB, enhancing the overall robustness of the product.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm enables high-density mounting, saving space on the PCB and facilitating efficient signal routing.

Technical Specifications

Clock Drivers & Buffers CDC857-3DGGRG4 attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G48

Maximum I (ol):

12 Amp

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

Sub-Category:

Clock Drivers

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Trade Compliance

CDC857-3DGGRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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