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CD74HC670ME4

Texas Instruments

CD74HC670ME4 by Texas Instruments

CD74HC670ME4 by Texas Instruments is a 16-terminal CMOS logic IC with 3-STATE output, operating b/w -55 to 125°C. It has a supply voltage range of 2V to 6V and is suitable for military-grade applications requiring small outline packaging in surface-mount technology.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,788 parts In-Stock

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Digiode

USA . 1,647 parts In-Stock

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Native Components

USA . 465 parts In-Stock

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$6.015

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One Stop Electronics

USA . 262 parts In-Stock

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$12.000

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AZTECH Wire

Italy . 729 parts In-Stock

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Parana Technologies

USA . 1,261 parts In-Stock

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$15.429

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$1,432.820

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$13.886

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DigiPath Technology Company

USA . 1,523 parts In-Stock

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$16.989

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$15.630

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ChromeModa Solutions

Germany . 6,832 parts In-Stock

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$17.336

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$14.216

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IDEA Electronic Components Group

UK . 2,175 parts In-Stock

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$16.469

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$15.602

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Northwest PG Solutions

USA . 883 parts In-Stock

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Corphita

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Overview

Experience the unmatched quality and reliability of Texas Instruments with the CD74HC670ME4, an exceptional Other Function Logic IC. Perfect for a wide range of applications, this product offers superior performance and efficiency. With Texas Instruments' reputation for excellence, you can trust that this IC will deliver outstanding results. Providing value, benefits, and advantages, the CD74HC670ME4 is the ideal choice for customers seeking a high-quality solution for their electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for the IC, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, making installation and assembly processes simpler.

Nominal Supply Voltage / Vsup (V): 4.5

The nominal supply voltage of 4.5V ensures stable and efficient performance of the IC within operating conditions.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this IC can withstand demanding environmental conditions.

Output Characteristics: 3-STATE

3-STATE output characteristics allow for flexible control of output signals, enhancing the versatility of the IC.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55°C ensures the IC can function effectively in cold environments.

Width: 3.9 mm

Compact width dimension of 3.9mm enables space-saving integration of the IC in tight layouts or designs.

Length: 9.9 mm

The length of 9.9mm provides a balance between compact size and functionality, making it suitable for various applications.

Temperature Grade: MILITARY

Military-grade temperature rating ensures high reliability and performance in harsh environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the IC energy-efficient and reliable.

Technical Specifications

Other Function Logic ICs CD74HC670ME4 attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

CD74HC670ME4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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