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CD74HC4049M96E4

Texas Instruments

CD74HC4049M96E4 by Texas Instruments

CD74HC4049M96E4 by Texas Instruments is a CMOS Logic Gates IC with 6 functions. It has a propagation delay of 26 ns at 4.5V, suitable for military-grade applications. With a small outline package and surface mount capability, it operates b/w -55 to 125 °C temperature range.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,769 parts In-Stock

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Digiode

USA . 2,823 parts In-Stock

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Nova Conductors

Japan . 20 parts In-Stock

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Parana Technologies

USA . 1,505 parts In-Stock

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$7.229

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$7.732

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$7.229

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IDEA Electronic Components Group

UK . 1,974 parts In-Stock

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$8.123

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$7.311

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ChromeModa Solutions

Germany . 578 parts In-Stock

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$8.123

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$6.661

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AZTECH Wire

Italy . 717 parts In-Stock

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$15.970

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One Stop Electronics

USA . 1,190 parts In-Stock

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$39.000

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Ampacity Inc.

Singapore . 1,503 parts In-Stock

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$48.000

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QUARKTWIN TECHNOLOGY LTD

USA . 12,270 parts In-Stock

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Continental Prestige Electronics

USA . 5,066 parts In-Stock

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Microchip USA

USA . 3,824 parts In-Stock

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Argo Parts USA

USA . 2,350 parts In-Stock

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DigiPath Technology Company

USA . 562 parts In-Stock

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Corphita

USA . 287 parts In-Stock

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Bastille Electronics

Australia . 46 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the Texas Instruments CD74HC4049M96E4 Logic Gates. Crafted with precision and quality by a trusted manufacturer, these gates offer unparalleled reliability and performance for a wide range of applications. With a focus on value and innovation, this product provides customers with a seamless experience, delivering fast propagation delays and low power consumption. Embrace the future of electronics with the CD74HC4049M96E4 and revolutionize your projects today.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides durability and protection for the logic gates.

Propagation Delay At Nominal Supply:

26 ns - This fast propagation delay ensures efficient processing of signals.

Surface Mount:

YES - The surface mount feature allows for easy installation on circuit boards.

No. of Functions:

6 - This product offers multiple functions in one package, saving space and cost.

Package Shape:

RECTANGULAR - The rectangular shape makes it easy to integrate into existing circuit designs.

Nominal Supply Voltage / Vsup (V):

4.5 - The nominal supply voltage ensures stable operation of the logic gates.

Load Capacitance (CL):

50 pF - This load capacitance ensures compatibility with different circuit configurations.

Power Supplies (V):

2/6 - This range of power supplies allows for versatile use in various applications.

No. of Terminals:

16 - The high number of terminals provides flexibility for connecting to other components.

Package Style (Meter):

SMALL OUTLINE - The small outline package saves space on the circuit board.

Maximum I (ol):

4 Amp - This high maximum output current capability allows for driving multiple loads.

Propagation Delay (tpd):

130 ns - This propagation delay ensures reliable and fast signal processing.

Maximum Operating Temperature:

125 °C - The high maximum operating temperature range allows for use in harsh environments.

Minimum Operating Temperature:

55 °C - The low minimum operating temperature ensures reliability in extreme conditions.

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au) - This terminal finish provides good conductivity and corrosion resistance.

Terminal Position:

DUAL - The dual terminal position allows for different mounting configurations.

Maximum Seated Height:

1.75 mm - The low maximum seated height saves space in compact designs.

Width:

3.9 mm - The small width of the package makes it suitable for tight spaces.

Minimum Supply Voltage (Vsup):

2 V - The low minimum supply voltage allows for operation in low-power applications.

Peak Reflow Temperature °C:

260 - This high peak reflow temperature ensures reliable soldering during assembly.

Length:

9.9 mm - The compact length of the package saves space on the circuit board.

Temperature Grade:

MILITARY - This temperature grade makes the logic gates suitable for military applications.

Technology:

CMOS - The CMOS technology used in these logic gates ensures low power consumption and high speed.

Terminal Form:

GULL WING - The gull wing terminal form provides mechanical strength and reliability in harsh conditions.

Packing Method:

TR - The tape and reel packing method facilitates automated assembly processes.

Terminal Pitch:

1.27 mm - The small terminal pitch allows for high-density mounting on the circuit board.

Maximum Supply Voltage (Vsup):

6 V - The high maximum supply voltage allows for operation in high-power applications.

Maximum Power Supply Current (ICC):

0.04 mA - This low power supply current ensures energy efficiency during operation.

Technical Specifications

Logic Gates CD74HC4049M96E4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Additional Features:

CMOS-TTL LEVEL TRANSLATOR

Family:

HC/UH

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

26 ns

Propagation Delay (tpd):

130 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

CD74HC4049M96E4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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