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CD74HC107MTE4

Texas Instruments

CD74HC107MTE4 by Texas Instruments

CD74HC107MTE4 by Texas Instruments is a dual-function latches & flip-flops IC with 51ns propagation delay at 4.5V. It operates b/w -55 to 125°C, has a max frequency of 20MHz, and is ideal for military-grade applications requiring fast signal processing in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,225 parts In-Stock

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Digiode

USA . 668 parts In-Stock

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668

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Distributors (Availability)

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Native Components

USA . 851 parts In-Stock

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$1.070

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851

$1.070

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Northwest PG Solutions

USA . 1,783 parts In-Stock

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$1.177

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AZTECH Wire

Italy . 712 parts In-Stock

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$5.843

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712

$5.843

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Parana Technologies

USA . 581 parts In-Stock

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$23.072

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$23.714

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581

$23.072

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DigiPath Technology Company

USA . 292 parts In-Stock

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$25.406

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292

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IDEA Electronic Components Group

UK . 1,631 parts In-Stock

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$25.924

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$24.628

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$23.332

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ChromeModa Solutions

Germany . 889 parts In-Stock

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$25.924

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$21.258

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One Stop Electronics

USA . 518 parts In-Stock

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$27.000

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Corphita

USA . 3,976 parts In-Stock

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Microchip USA

USA . 3,614 parts In-Stock

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Overview

Enhance your electronic projects with the high-quality CD74HC107MTE4 by Texas Instruments. As a trusted manufacturer in the industry, Texas Instruments offers top-tier latches & flip-flops that guarantee reliability and performance. This versatile component excels in a wide range of applications, providing customers with seamless functionality and ease of use. With its advanced technology and superior design, the CD74HC107MTE4 delivers exceptional value and benefits, making it an essential choice for all your circuit design needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the latch & flip-flop lightweight and durable.

Propagation Delay At Nominal Supply: 51 ns

With a low propagation delay, this latch & flip-flop can quickly respond to input signals, making it suitable for high-speed applications.

Surface Mount: YES

The ability to be surface mounted simplifies the installation process and saves space on the PCB.

No. of Functions: 2

Having multiple functions allows for versatility in circuit design and operation.

Nominal Supply Voltage / Vsup (V): 4.5

The nominal supply voltage of 4.5V ensures compatibility with a variety of power sources.

Maximum Operating Temperature: 125 °C

The latch & flip-flop can operate at high temperatures, making it suitable for use in challenging environments.

Trigger Type: NEGATIVE EDGE

The negative edge trigger type allows for precise control and timing of the latch & flip-flop.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this latch & flip-flop energy-efficient and reliable.

Technical Specifications

Latches & Flip-Flops CD74HC107MTE4 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

20000000 Hz

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

2

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

51 ns

Propagation Delay (tpd):

255 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

NEGATIVE EDGE

Width:

3.9 mm

Minimum fmax:

23 MHz

Trade Compliance

CD74HC107MTE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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