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CD40109BK3

Texas Instruments

CD40109BK3 by Texas Instruments

CD40109BK3 by Texas Instruments is a 4-bit bus driver with 600 ns propagation delay. It operates b/w -55 to 125 °C and supports a supply voltage range of 3-18 V. Ideal for military-grade applications requiring true output polarity and dual terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,581 parts In-Stock

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Digiode

USA . 2,889 parts In-Stock

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Electronic Expediters

USA . 363 parts In-Stock

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Bristol Electronics

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Corel Iberica Componentes, S.L.

Spain . 16 parts In-Stock

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Native Components

USA . 836 parts In-Stock

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$0.392

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$0.376

836

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Northwest PG Solutions

USA . 1,384 parts In-Stock

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$0.431

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$0.380

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$0.380

AZTECH Wire

Italy . 416 parts In-Stock

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$14.354

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Parana Technologies

USA . 1,891 parts In-Stock

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$22.114

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$22.719

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DigiPath Technology Company

USA . 604 parts In-Stock

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$24.350

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$22.402

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ChromeModa Solutions

Germany . 3,923 parts In-Stock

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$24.847

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$20.375

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IDEA Electronic Components Group

UK . 704 parts In-Stock

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$24.847

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$23.605

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$22.362

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Andel Nordic

Denmark . 555 parts In-Stock

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$26.990

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$18.891

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One Stop Electronics

USA . 1,035 parts In-Stock

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Corphita

USA . 4,479 parts In-Stock

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Supply Digital

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Assy Fe

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Overview

Experience superior quality and reliability with the CD40109BK3 by Texas Instruments. As a trusted manufacturer in the industry, Texas Instruments delivers top-notch bus drivers & transceivers that are perfect for a wide range of applications. With a ceramic, glass-sealed package and true 3-state output characteristics, this product offers unmatched value and performance. Whether you're working on military-grade projects or commercial applications, the CD40109BK3 provides the precision and efficiency you need to succeed. Trust Texas Instruments for all your semiconductor needs.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material provides durability and reliability, ensuring the product can withstand harsh operating conditions.

No. of Bits: 4

With 4 bits, this bus driver & transceiver can handle a moderate amount of data, making it suitable for various communication protocols.

Nominal Supply Voltage / Vsup (V): 5

Operating at a common supply voltage of 5V makes integration into existing systems easier.

Maximum Operating Temperature: 125 °C

With a high operating temperature range, this product can function reliably in a wide range of environments.

Output Characteristics: 3-STATE

3-state outputs allow for efficient control of the bus lines, enabling versatile data transmission.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, improving the overall efficiency of the device.

Technical Specifications

Bus Driver & Transceivers CD40109BK3 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

LOW TO HIGH VOLTAGE TRANSLATOR

Family:

4000/14000/40000

JESD-30 Code:

R-GDFP-F16

Logic IC Type:

No. of Bits:

4

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Propagation Delay (tpd):

600 ns

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

CD40109BK3 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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