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CC2630F128RSMR

Texas Instruments

CC2630F128RSMR by Texas Instruments

CC2630F128RSMR by Texas Instruments is a 16-bit microcontroller with 32 terminals, operating at temperatures from -40 to 85°C. It features ADC and DMA channels, PWM support, and ROM programmability for industrial applications requiring a compact chip carrier package with a low profile design.

Median Price

$3.911

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 111,655 parts In-Stock

1+ parts

$3.911

100+ parts

$3.427

1k+ parts

$1.936

10k+ parts

-

111,655

$3.911

$3.427

$1.936

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,249 parts In-Stock

1+ parts

$3.715

100+ parts

-

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-

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2,249

$3.715

-

-

-

Vyrian

USA . 6,725 parts In-Stock

1+ parts

-

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6,725

-

-

-

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

-

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50

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Distributors (Availability)

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Corohmni

South Africa . 643 parts In-Stock

1+ parts

$1.936

100+ parts

-

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-

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643

$1.936

-

-

-

Semicontronic

India . 111,519 parts In-Stock

1+ parts

$3.320

100+ parts

$3.237

1k+ parts

$3.220

10k+ parts

-

111,519

$3.320

$3.237

$3.220

-

Ampacity Inc.

Singapore . 111,481 parts In-Stock

1+ parts

$3.320

100+ parts

-

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111,481

$3.320

-

-

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Corphita

USA . 4,458 parts In-Stock

1+ parts

$3.520

100+ parts

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4,458

$3.520

-

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AZTECH Wire

Italy . 416 parts In-Stock

1+ parts

$21.860

100+ parts

-

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416

$21.860

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-

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Parana Technologies

USA . 1,533 parts In-Stock

1+ parts

$48.181

100+ parts

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1,533

$48.181

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ChromeModa Solutions

Germany . 6,515 parts In-Stock

1+ parts

$54.136

100+ parts

$44.392

1k+ parts

-

10k+ parts

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6,515

$54.136

$44.392

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IDEA Electronic Components Group

UK . 173 parts In-Stock

1+ parts

$54.136

100+ parts

$51.429

1k+ parts

$48.722

10k+ parts

-

173

$54.136

$51.429

$48.722

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Component Stockers USA

USA . 55,141 parts In-Stock

1+ parts

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55,141

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Continental Prestige Electronics

USA . 2,705 parts In-Stock

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2,705

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Argo Parts USA

USA . 2,314 parts In-Stock

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2,314

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DigiPath Technology Company

USA . 2,028 parts In-Stock

1+ parts

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100+ parts

$48.809

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2,028

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$48.809

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Aranea Global

USA . 100 parts In-Stock

1+ parts

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100

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Kepictronics

USA . 40 parts In-Stock

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40

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Overview

Experience the cutting-edge technology of the CC2630F128RSMR by Texas Instruments, a high-quality microcontroller that offers unparalleled performance and reliability. Designed by the industry leader in semiconductor manufacturing, this chip is versatile and ideal for a wide range of applications. From IoT devices to industrial automation, this microcontroller provides seamless integration and superior functionality. Trust in Texas Instruments to deliver top-notch products that exceed expectations and bring value to your projects. Upgrade your designs with the CC2630F128RSMR and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the microcontroller, ensuring it can withstand various environmental conditions.

Surface Mount: YES

Surface mount capability makes it easy to integrate this microcontroller onto a circuit board, saving space and simplifying the assembly process.

Maximum Supply Voltage: 3.8 V

With a maximum supply voltage of 3.8V, this microcontroller can handle higher voltage inputs, making it versatile for a range of applications.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage of 1.8V allows for efficient power consumption and operation in low power scenarios.

ADC Channels: YES

The presence of ADC (Analog-to-Digital Converter) channels enables the microcontroller to convert analog signals to digital data, expanding its functionality.

DMA Channels: YES

DMA (Direct Memory Access) channels improve data transfer efficiency by allowing data to be transferred between peripherals and memory without CPU intervention.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC (Reduced Instruction Set Computing) architecture simplifies instruction execution, enhancing the performance of the microcontroller.

ROM Programmability: FLASH

The use of Flash memory for ROM (Read-Only Memory) allows for easy reprogramming of the microcontroller, enabling flexibility and upgradability.

Technology: CMOS

CMOS (Complementary Metal-Oxide-Semiconductor) technology offers low power consumption, high noise immunity, and fast switching speeds, making the microcontroller efficient and reliable.

Speed: 48 rpm

A speed of 48 rpm indicates the processing speed of the microcontroller, which is suitable for various real-time applications requiring quick data processing.

Technical Specifications

Microcontrollers CC2630F128RSMR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

10

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

48 rpm

Maximum Supply Voltage:

3.8 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4 mm

Peripheral IC Type:

Trade Compliance

CC2630F128RSMR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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