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CC2630F128RHBR

Texas Instruments

CC2630F128RHBR by Texas Instruments

CC2630F128RHBR by Texas Instruments is a 16-bit microcontroller with 32 terminals, operating b/w -40 to 85°C. It features ADC and DMA channels, PWM support, and ROM programmability for industrial applications requiring a compact chip carrier package with a low profile design.

Median Price

$3.709

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 446,444 parts In-Stock

1+ parts

$3.709

100+ parts

$3.250

1k+ parts

$1.836

10k+ parts

-

446,444

$3.709

$3.250

$1.836

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 643 parts In-Stock

1+ parts

$3.524

100+ parts

-

1k+ parts

-

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643

$3.524

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-

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Vyrian

USA . 2,368 parts In-Stock

1+ parts

-

100+ parts

-

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-

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-

2,368

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,604 parts In-Stock

1+ parts

$3.338

100+ parts

-

1k+ parts

-

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2,604

$3.338

-

-

-

AZTECH Wire

Italy . 590 parts In-Stock

1+ parts

$21.000

100+ parts

-

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590

$21.000

-

-

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Parana Technologies

USA . 1,533 parts In-Stock

1+ parts

$55.752

100+ parts

-

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1,533

$55.752

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-

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DigiPath Technology Company

USA . 786 parts In-Stock

1+ parts

$61.390

100+ parts

$56.479

1k+ parts

-

10k+ parts

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786

$61.390

$56.479

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-

ChromeModa Solutions

Germany . 6,201 parts In-Stock

1+ parts

$62.643

100+ parts

$51.367

1k+ parts

-

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6,201

$62.643

$51.367

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IDEA Electronic Components Group

UK . 449 parts In-Stock

1+ parts

$62.643

100+ parts

$59.511

1k+ parts

$56.379

10k+ parts

-

449

$62.643

$59.511

$56.379

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Perfect Parts

USA . 5,600 parts In-Stock

1+ parts

-

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5,600

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Northwest PG Solutions

USA . 2,229 parts In-Stock

1+ parts

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$3.556

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2,229

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$3.556

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Kepictronics

USA . 2,000 parts In-Stock

1+ parts

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2,000

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iodParts Technologies Inc.

India . 250 parts In-Stock

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250

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Native Components

USA . 61 parts In-Stock

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$3.519

10k+ parts

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61

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$3.519

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Overview

Unlock the power of cutting-edge technology with the CC2630F128RHBR microcontroller from Texas Instruments. Designed with precision and quality in mind, this device offers unmatched performance and reliability for a wide range of applications. Whether you're working on IoT projects, wireless sensor networks, or industrial automation, this microcontroller delivers exceptional value with its advanced features and capabilities. Experience seamless integration, high-speed processing, and efficient power management with this innovative solution. Upgrade your projects with the CC2630F128RHBR and bring your ideas to life like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good insulation and protection for the microcontroller, ensuring durability and longevity.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the microcontroller onto PCBs, saving space and reducing overall manufacturing costs.

Maximum Supply Voltage: 3.8 V

A higher maximum supply voltage allows for flexibility in power input options, making the microcontroller suitable for a wide range of applications.

Bit Size: 16

16-bit architecture provides sufficient processing power for various tasks while still being energy efficient, making it a good balance for many applications.

ADC Channels: YES

Having Analog-to-Digital Converter (ADC) channels built into the microcontroller enables it to interface with analog sensors and signals, expanding its utility in data acquisition applications.

DMA Channels: YES

Direct Memory Access (DMA) channels allow for efficient data transfer between peripherals and memory without CPU intervention, optimizing performance and reducing latency.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption and high noise immunity, making the microcontroller energy efficient and reliable in noisy environments.

PWM Channels: YES

Pulse-Width Modulation (PWM) channels enable precise control of analog circuits and devices, making the microcontroller suitable for applications such as motor control and LED dimming.

ROM Programmability: FLASH

Flash programmable memory allows for easy and quick reprogramming of the microcontroller, facilitating firmware updates and customization of functions without the need for external programming tools.

Technical Specifications

Microcontrollers CC2630F128RHBR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

15

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

48 rpm

Maximum Supply Voltage:

3.8 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Trade Compliance

CC2630F128RHBR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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