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CAHCT1G126QDCKRG4Q

Texas Instruments

CAHCT1G126QDCKRG4Q by Texas Instruments

CAHCT1G126QDCKRG4Q by Texas Instruments is a 5-terminal bus driver with 16ns propagation delay at 4.5V, suitable for automotive applications. It features a small outline package with true output polarity and 3-state characteristics, operating b/w -40 to 125°C. The device has a max supply voltage of 5.5V and can handle up to 8A of Iol.

Median Price

$0.450

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 14,904 parts In-Stock

1+ parts

$0.450

100+ parts

$0.245

1k+ parts

$0.207

10k+ parts

$0.188

14,904

$0.450

$0.245

$0.207

$0.188

Mouser Electronics

USA . 2,985 parts In-Stock

1+ parts

$0.450

100+ parts

$0.245

1k+ parts

$0.208

10k+ parts

$0.190

2,985

$0.450

$0.245

$0.208

$0.190

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,030 parts In-Stock

1+ parts

$0.380

100+ parts

-

1k+ parts

-

10k+ parts

-

4,030

$0.380

-

-

-

Vyrian

USA . 4,678 parts In-Stock

1+ parts

$0.400

100+ parts

-

1k+ parts

-

10k+ parts

-

4,678

$0.400

-

-

-

Chip Stock

USA . 66,190 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

66,190

-

-

-

-

PC Components Company LLC

USA . 14 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

14

-

-

-

-

Bristol Electronics

USA . 14 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

14

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,482 parts In-Stock

1+ parts

$0.360

100+ parts

-

1k+ parts

-

10k+ parts

-

3,482

$0.360

-

-

-

Native Components

USA . 825 parts In-Stock

1+ parts

$0.496

100+ parts

-

1k+ parts

-

10k+ parts

-

825

$0.496

-

-

-

Northwest PG Solutions

USA . 82 parts In-Stock

1+ parts

$0.546

100+ parts

-

1k+ parts

-

10k+ parts

$0.481

82

$0.546

-

-

$0.481

Andel Nordic

Denmark . 1,809 parts In-Stock

1+ parts

$7.696

100+ parts

-

1k+ parts

$7.389

10k+ parts

$7.389

1,809

$7.696

-

$7.389

$7.389

Parana Technologies

USA . 1,982 parts In-Stock

1+ parts

$12.006

100+ parts

-

1k+ parts

$12.411

10k+ parts

-

1,982

$12.006

-

$12.411

-

DigiPath Technology Company

USA . 2,307 parts In-Stock

1+ parts

$13.220

100+ parts

$12.163

1k+ parts

-

10k+ parts

-

2,307

$13.220

$12.163

-

-

ChromeModa Solutions

Germany . 4,016 parts In-Stock

1+ parts

$13.490

100+ parts

$11.062

1k+ parts

-

10k+ parts

-

4,016

$13.490

$11.062

-

-

IDEA Electronic Components Group

UK . 1,278 parts In-Stock

1+ parts

$13.490

100+ parts

$12.816

1k+ parts

$12.141

10k+ parts

-

1,278

$13.490

$12.816

$12.141

-

Microchip USA

USA . 2,865 parts In-Stock

1+ parts

$16.950

100+ parts

$16.710

1k+ parts

$16.590

10k+ parts

$16.460

2,865

$16.950

$16.710

$16.590

$16.460

A-Z Elektronik GmbH

Germany . 7,164 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,164

-

-

-

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Lixinc

USA . 5,819 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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5,819

-

-

-

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Alle Elektronik GmbH

Germany . 4,776 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,776

-

-

-

-

Overview

Enhance your electronic projects with the CAHCT1G126QDCKRG4Q by Texas Instruments. Manufactured with top-quality materials and advanced technology, this Bus Driver & Transceiver offers reliable performance and durability. Ideal for a wide range of applications, this product provides fast propagation delay and high output characteristics. With a compact design and versatile features, customers can enjoy seamless integration and enhanced functionality. Elevate your projects to the next level with the value and benefits that this innovative product brings.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for the product, making it suitable for various environmental conditions.

Propagation Delay At Nominal Supply: 16 ns

Low propagation delay ensures quick and efficient communication, making the product suitable for high-speed data transmission.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving space and reducing assembly time.

Nominal Supply Voltage / Vsup (V): 4.5

Optimal supply voltage ensures stable and consistent performance of the product, enhancing its overall reliability.

Load Capacitance (CL): 50 pF

Appropriate load capacitance ensures efficient signal transmission and reception, improving the overall functionality of the product.

No. of Terminals: 5

Having a sufficient number of terminals allows for easy connectivity and integration with other components in a circuit.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact package style with a thin profile and shrink pitch saves space on the PCB and enhances the product's overall efficiency.

Maximum I (ol): 8 Amp

High output current capability allows the product to drive heavy loads, making it suitable for a wide range of applications.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures the product can withstand harsh environmental conditions, making it reliable for various applications.

Output Characteristics: 3-STATE

3-state output allows for versatile control over the output signal, providing flexibility in signal routing and management.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures the product can function in extreme cold conditions, increasing its versatility for different environments.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature range and reliability make the product suitable for automotive applications where temperature variations are common.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, improving the efficiency and reliability of the product.

Technical Specifications

Bus Driver & Transceivers CAHCT1G126QDCKRG4Q attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE HIGH

Count Direction:

UNIDIRECTIONAL

Family:

AHCT/VHCT/VT

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

16 ns

Propagation Delay (tpd):

16 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

1.25 mm

Trade Compliance

CAHCT1G126QDCKRG4Q Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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