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CAHCT1G126QDCKRQ1

Texas Instruments

CAHCT1G126QDCKRQ1 by Texas Instruments

CAHCT1G126QDCKRQ1 by Texas Instruments is a 3-STATE bus driver with a propagation delay of 16ns, suitable for automotive applications. It operates at a voltage range of 3V to 5.5V and has a max operating temperature of 125°C. This small outline package with dual terminals is designed for high-speed data transmission in automotive systems.

Median Price

$0.270

Lifecycle Status

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1k+

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DigiKey

USA . 13,397 parts In-Stock

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$0.270

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$0.142

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$0.119

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$0.107

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Mouser Electronics

USA . 2,743 parts In-Stock

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$0.270

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$0.143

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$0.119

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Nova Conductors

Japan . 10 parts In-Stock

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$0.164

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$0.164

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Digiode

USA . 1,102 parts In-Stock

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$0.352

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Chip Stock

USA . 92,500 parts In-Stock

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Vyrian

USA . 19,570 parts In-Stock

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Bristol Electronics

USA . 3,000 parts In-Stock

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$0.246

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$0.148

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$0.098

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$0.246

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$0.098

Dan-Mar Components

USA . 3,000 parts In-Stock

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Tectiva GmbH

Germany . 2,610 parts In-Stock

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Manotoh

Italy . 845 parts In-Stock

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ComSIT Distribution GmbH

Germany . 3 parts In-Stock

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Argo Parts USA

USA . 1,345 parts In-Stock

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$0.164

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$0.159

1,345

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$0.159

Continental Prestige Electronics

USA . 839 parts In-Stock

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$0.164

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$0.161

839

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$0.161

Bastille Electronics

Australia . 40 parts In-Stock

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$0.164

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$0.156

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$0.148

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$0.146

40

$0.164

$0.156

$0.148

$0.146

Corphita

USA . 3,830 parts In-Stock

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$0.333

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Ampacity Inc.

Singapore . 30,195 parts In-Stock

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$0.426

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Microchip USA

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$0.944

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Andel Nordic

Denmark . 373 parts In-Stock

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$6.841

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$6.567

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$6.567

373

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$6.567

Parana Technologies

USA . 1,843 parts In-Stock

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$22.234

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$22.897

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DigiPath Technology Company

USA . 949 parts In-Stock

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$24.482

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$24.482

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ChromeModa Solutions

Germany . 6,574 parts In-Stock

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$24.982

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$20.485

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IDEA Electronic Components Group

UK . 1,003 parts In-Stock

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A-Z Elektronik GmbH

Germany . 13,521 parts In-Stock

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Lixinc

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Alle Elektronik GmbH

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Kepictronics

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Assy Fe

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Overview

Enhance your automotive applications with the high-quality CAHCT1G126QDCKRQ1 bus driver & transceiver from Texas Instruments. Designed with precision and reliability in mind, this product offers a fast propagation delay of 16 ns and a maximum operating temperature of 125°C. With a compact package style and true output polarity, this component delivers exceptional performance while ensuring seamless integration into your designs. Trust Texas Instruments for cutting-edge technology that exceeds expectations and propels your projects to new heights. Choose the CAHCT1G126QDCKRQ1 for unparalleled value and unmatched benefits in every application.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable.

Propagation Delay At Nominal Supply: 16 ns

With a low propagation delay, this product offers fast and efficient signal transmission.

Surface Mount: YES

Being surface mountable, this product is easy to install and saves valuable space on the PCB.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and performance under harsh automotive conditions.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy integration into existing circuit designs.

Nominal Supply Voltage / Vsup: 4.5V

The 4.5V supply voltage provides a stable power source for consistent operation.

Load Capacitance (CL): 50 pF

With a load capacitance of 50 pF, this product can drive a wide range of loads effectively.

No. of Terminals: 5

The 5 terminals provide ample connectivity options for versatile application use.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This package style offers a compact and space-saving design for efficient PCB layout.

Maximum I (ol): 8 Amp

With a maximum output current of 8 Amps, this product can drive high-power loads with ease.

Technical Specifications

Bus Driver & Transceivers CAHCT1G126QDCKRQ1 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE HIGH

Count Direction:

UNIDIRECTIONAL

Family:

AHCT/VHCT/VT

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

16 ns

Propagation Delay (tpd):

16 ns

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

1.25 mm

Trade Compliance

CAHCT1G126QDCKRQ1 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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