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C55EQUAL

Texas Instruments

C55EQUAL by Texas Instruments

C55EQUAL by Texas Instruments is a DSP with 32-bit external data bus width and 20-bit address bus width. It operates at temperatures ranging from -40 to 85°C, making it suitable for industrial applications requiring low power consumption. With boundary scan support and a max supply voltage of 1.32V, this DSP is ideal for various digital signal processing tasks.

Median Price

$8.498

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 43 parts In-Stock

1+ parts

$8.498

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43

$8.498

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Digiode

USA . 4,895 parts In-Stock

1+ parts

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4,895

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Vyrian

USA . 3,212 parts In-Stock

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3,212

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 341 parts In-Stock

1+ parts

$6.000

100+ parts

-

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341

$6.000

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Netroflash

USA . 1,000 parts In-Stock

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$8.498

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1,000

$8.498

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Corohmni

South Africa . 469 parts In-Stock

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$9.712

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469

$9.712

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AZTECH Wire

Italy . 519 parts In-Stock

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$11.861

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519

$11.861

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Microchip USA

USA . 2,689 parts In-Stock

1+ parts

$23.800

100+ parts

$23.460

1k+ parts

$23.290

10k+ parts

$23.120

2,689

$23.800

$23.460

$23.290

$23.120

Parana Technologies

USA . 398 parts In-Stock

1+ parts

$24.145

100+ parts

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$24.799

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398

$24.145

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$24.799

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Ampacity Inc.

Singapore . 874 parts In-Stock

1+ parts

$27.000

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874

$27.000

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ChromeModa Solutions

Germany . 3,193 parts In-Stock

1+ parts

$27.129

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$22.246

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3,193

$27.129

$22.246

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IDEA Electronic Components Group

UK . 1,334 parts In-Stock

1+ parts

$27.129

100+ parts

$25.773

1k+ parts

$24.416

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1,334

$27.129

$25.773

$24.416

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DigiPath Technology Company

USA . 918 parts In-Stock

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$24.460

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918

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$24.460

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Corphita

USA . 262 parts In-Stock

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262

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Overview

Discover the power of the C55EQUAL by Texas Instruments, a top-of-the-line Digital Signal Processor that promises unmatched performance and reliability. Manufactured by industry leader Texas Instruments, this cutting-edge DSP is perfect for a wide range of applications. With its superior quality and advanced features, the C55EQUAL offers customers unparalleled value and benefits. Experience the difference with the C55EQUAL and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the DSP, ensuring a longer lifespan.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, making it ideal for mass production.

Maximum Supply Voltage: 1.32 V

The high maximum supply voltage allows for flexibility in power supply options, increasing compatibility with different systems.

Address Bus Width: 20

A wider address bus allows for more memory addressing capability, enabling the DSP to handle larger data sets efficiently.

No. of Terminals: 176

The high number of terminals provides ample connectivity options for interfacing with other components in a system.

Minimum Operating Temperature: -40 °C

The wide operating temperature range ensures reliable performance even in harsh environmental conditions.

External Data Bus Width: 32

A wide external data bus allows for high-speed data transfer, improving overall processing performance.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures robust solder joints during manufacturing, enhancing reliability.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The specific type of peripheral IC indicates that this DSP is specialized for digital signal processing applications, ensuring optimal performance in such tasks.

Technical Specifications

Digital Signal Processors (DSPs) C55EQUAL attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

20

Barrel Shifter:

NO

Boundary Scan:

YES

External Data Bus Width:

32

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G176

JESD-609 Code:

e4

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

176

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.2 V

Nominal Supply Voltage:

1.26 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

C55EQUAL Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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