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BQ77PL157APW-4225

Texas Instruments

BQ77PL157APW-4225 by Texas Instruments

BQ77PL157APW-4225 by Texas Instruments is a Power Management IC with 16 terminals, operating voltage range of 4.2V to 30V, and temperature range of -40°C to 85°C. It is designed for industrial applications requiring power supply support circuits in compact form factors.

Median Price

$1.581

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 8,420 parts In-Stock

1+ parts

$1.581

100+ parts

$1.306

1k+ parts

$0.706

10k+ parts

-

8,420

$1.581

$1.306

$0.706

-

DigiKey

USA . 733 parts In-Stock

1+ parts

$2.180

100+ parts

$1.327

1k+ parts

$1.194

10k+ parts

-

733

$2.180

$1.327

$1.194

-

Rochester

USA . 240 parts In-Stock

1+ parts

-

100+ parts

$1.380

1k+ parts

$1.150

10k+ parts

$1.020

240

-

$1.380

$1.150

$1.020

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 121 parts In-Stock

1+ parts

$0.932

100+ parts

-

1k+ parts

-

10k+ parts

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121

$0.932

-

-

-

Vyrian

USA . 2,676 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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2,676

-

-

-

-

Bristol Electronics

USA . 85 parts In-Stock

1+ parts

-

100+ parts

$1.400

1k+ parts

-

10k+ parts

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85

-

$1.400

-

-

Microfarads

USA . 82 parts In-Stock

1+ parts

-

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-

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82

-

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Lantek

USA . 64 parts In-Stock

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64

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 475 parts In-Stock

1+ parts

$0.169

100+ parts

-

1k+ parts

-

10k+ parts

$0.163

475

$0.169

-

-

$0.163

Northwest PG Solutions

USA . 1,020 parts In-Stock

1+ parts

$0.186

100+ parts

-

1k+ parts

-

10k+ parts

$0.164

1,020

$0.186

-

-

$0.164

Corphita

USA . 4,099 parts In-Stock

1+ parts

$0.883

100+ parts

-

1k+ parts

-

10k+ parts

-

4,099

$0.883

-

-

-

Component Stockers USA

USA . 6,063 parts In-Stock

1+ parts

$1.000

100+ parts

$0.940

1k+ parts

$0.760

10k+ parts

-

6,063

$1.000

$0.940

$0.760

-

Parana Technologies

USA . 506 parts In-Stock

1+ parts

$9.879

100+ parts

-

1k+ parts

$10.448

10k+ parts

-

506

$9.879

-

$10.448

-

DigiPath Technology Company

USA . 1,371 parts In-Stock

1+ parts

$10.878

100+ parts

-

1k+ parts

-

10k+ parts

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1,371

$10.878

-

-

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ChromeModa Solutions

Germany . 6,797 parts In-Stock

1+ parts

$11.100

100+ parts

$9.102

1k+ parts

-

10k+ parts

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6,797

$11.100

$9.102

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-

IDEA Electronic Components Group

UK . 8 parts In-Stock

1+ parts

$11.100

100+ parts

$10.545

1k+ parts

$9.990

10k+ parts

-

8

$11.100

$10.545

$9.990

-

Microchip USA

USA . 1,098 parts In-Stock

1+ parts

$13.650

100+ parts

$13.570

1k+ parts

$13.520

10k+ parts

$13.480

1,098

$13.650

$13.570

$13.520

$13.480

Lixinc

USA . 13,905 parts In-Stock

1+ parts

-

100+ parts

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13,905

-

-

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A-Z Elektronik GmbH

Germany . 5,243 parts In-Stock

1+ parts

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5,243

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Alle Elektronik GmbH

Germany . 3,495 parts In-Stock

1+ parts

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3,495

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Perfect Parts

USA . 596 parts In-Stock

1+ parts

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596

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Authorized Procurement Solutions

USA . 300 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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300

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-

Overview

Elevate your power management capabilities with the BQ77PL157APW-4225 by Texas Instruments. Known for their top-notch quality and innovative solutions, Texas Instruments delivers a cutting-edge Power Management IC that is a game-changer in the industry. With a small outline, thin profile and shrink pitch package style, this IC offers unparalleled performance in a compact design. Whether you're looking to optimize battery charging or protect your power supply circuit, this product provides reliable and efficient solutions. Experience the superior value, benefits, and advantages that this Texas Instruments IC brings to your applications.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, ensuring long-term performance.

Surface Mount: YES

Allows for easy installation on PCBs, saving time and effort during assembly.

Power Supplies (V): 4.2/30

Supports a wide range of power supply voltages, making it versatile for various applications.

Package Shape: RECTANGULAR

Efficient use of space on the PCB and easy integration into existing designs.

No. of Terminals: 16

Provides ample connectivity options for interfacing with other components.

Maximum Operating Temperature: 85 °C

Can operate effectively in high-temperature environments, increasing reliability.

Minimum Operating Temperature: -40 °C

Suitable for use in cold climates or industrial applications with low temperatures.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Ensures excellent conductivity and corrosion resistance for long-term performance.

Terminal Position: DUAL

Offers flexibility in mounting options and connection configurations.

Maximum Seated Height: 1.2 mm

Low profile design saves space and allows for compact device designs.

Width (mm): 4.4 mm

Compact size enables easy integration into tight spaces on the PCB.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Specifically designed to support power management functions, ensuring efficient operation.

Minimum Supply Voltage (Vsup): 4.2 V

Guarantees reliable operation within the specified voltage range.

Peak Reflow Temperature °C: 260

Can withstand high temperatures during the reflow soldering process, ensuring secure attachment to the PCB.

Length: 5 mm

Compact size for easy integration into various device designs.

Nominal Threshold Voltage (V): +1.2V

Provides a reference voltage for accurate power management functions.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments and temperature fluctuations.

Maximum Supply Current (Isup): 0.0035 mA

Low power consumption for energy-efficient operation.

Terminal Form: GULL WING

Facilitates easy soldering and strong mechanical connections to the PCB.

Terminal Pitch: 0.65 mm

Compact terminal spacing for efficient use of PCB space.

Moisture Sensitivity Level (MSL): 2

Suitable for environments with moderate humidity levels, ensuring reliability.

Maximum Supply Voltage (Vsup): 30 V

Can handle high supply voltages for a wide range of applications.

Technical Specifications

Power Management ICs BQ77PL157APW-4225 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

Battery over-voltage protection(Min/Max)(V) : 4.225 and 4.225

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

4.2/30

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.0035 mA

Maximum Supply Voltage (Vsup):

30 V

Minimum Supply Voltage (Vsup):

4.2 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+1.2V

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

4.4 mm

Trade Compliance

BQ77PL157APW-4225 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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