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BQ77PL900DLG4

Texas Instruments

BQ77PL900DLG4 by Texas Instruments

BQ77PL900DLG4 by Texas Instruments is a Power Management IC with 10 channels and a supply voltage range of 7-50V. It features adjustable threshold, operates b/w -25 to 85°C, and has a compact rectangular package ideal for power supply management circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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VNN

France . 14,218 parts In-Stock

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Vyrian

USA . 7,116 parts In-Stock

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Digiode

USA . 1,656 parts In-Stock

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Nova Conductors

Japan . 450 parts In-Stock

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450

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Ampacity Inc.

Singapore . 1,208 parts In-Stock

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$0.500

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$0.500

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One Stop Electronics

USA . 204 parts In-Stock

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$1.500

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204

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Parana Technologies

USA . 2,305 parts In-Stock

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$3.963

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$368.040

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$3.567

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2,305

$3.963

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$3.567

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DigiPath Technology Company

USA . 1,075 parts In-Stock

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$4.364

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$4.015

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IDEA Electronic Components Group

UK . 2,089 parts In-Stock

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$4.453

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$4.008

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ChromeModa Solutions

Germany . 471 parts In-Stock

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$4.453

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$3.651

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471

$4.453

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Semicontronic

India . 1,613 parts In-Stock

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$4.500

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$4.388

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$4.365

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AZTECH Wire

Italy . 472 parts In-Stock

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$15.320

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472

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Corohmni

South Africa . 415 parts In-Stock

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$18.211

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Continental Prestige Electronics

USA . 6,915 parts In-Stock

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Argo Parts USA

USA . 3,924 parts In-Stock

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Corphita

USA . 494 parts In-Stock

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Bastille Electronics

Australia . 50 parts In-Stock

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Overview

Elevate your power management game with the BQ77PL900DLG4 by Texas Instruments. Crafted from high-quality materials and boasting advanced technology, this Power Management IC is a must-have for various applications. With its compact design and impressive capabilities, customers can expect optimal performance and reliability. Say goodbye to power supply issues and hello to seamless operation with this innovative product. Experience the value, benefits, and advantages that only Texas Instruments can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package material provides durability and protection for the IC, making it suitable for various environmental conditions.

Surface Mount: YES

With surface mount capability, this IC can be easily integrated onto circuit boards, saving space and facilitating automated assembly processes.

Nominal Supply Voltage (Vsup): 36 V

The 36V supply voltage allows for flexibility in power input options, making it compatible with a range of devices and systems.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures reliable performance even in demanding thermal conditions.

No. of Terminals: 48

With a large number of terminals, this IC offers versatile connectivity options for interfacing with other components in a circuit.

Technical Specifications

Power Management ICs BQ77PL900DLG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

15.875 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

10

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP48,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

7/50

Qualification:

Not Qualified

Maximum Seated Height:

2.79 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.8 mA

Maximum Supply Voltage (Vsup):

50 V

Minimum Supply Voltage (Vsup):

7 V

Nominal Supply Voltage (Vsup):

36 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7.49 mm

Trade Compliance

BQ77PL900DLG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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