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BQ7791508PW

Texas Instruments

BQ7791508PW by Texas Instruments

POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: TSSOP; Package Shape: RECTANGULAR; Surface Mount: YES;

Median Price

$2.452

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 15,355 parts In-Stock

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$1.555

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$1.284

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$0.694

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$1.555

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Mouser Electronics

USA . 89 parts In-Stock

1+ parts

$3.350

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$2.000

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$1.410

10k+ parts

$1.100

89

$3.350

$2.000

$1.410

$1.100

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,879 parts In-Stock

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$1.477

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-

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4,879

$1.477

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TME

Poland . 290 parts In-Stock

1+ parts

$3.790

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$2.270

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$1.520

10k+ parts

$1.390

290

$3.790

$2.270

$1.520

$1.390

Vyrian

USA . 6,435 parts In-Stock

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VNN

France . 1,230 parts In-Stock

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Nova Conductors

Japan . 54 parts In-Stock

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Semicontronic

India . 7,706 parts In-Stock

1+ parts

$1.320

100+ parts

$1.287

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$1.280

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7,706

$1.320

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Corphita

USA . 552 parts In-Stock

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$1.400

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$1.400

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Ampacity Inc.

Singapore . 7,417 parts In-Stock

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$2.880

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Microchip USA

USA . 2,199 parts In-Stock

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$6.606

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$6.649

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$6.316

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$6.316

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Parana Technologies

USA . 2,243 parts In-Stock

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$19.882

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$19.836

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DigiPath Technology Company

USA . 1,539 parts In-Stock

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$21.892

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$20.141

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ChromeModa Solutions

Germany . 4,644 parts In-Stock

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IDEA Electronic Components Group

UK . 1,090 parts In-Stock

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$20.105

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Corohmni

South Africa . 30 parts In-Stock

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$24.928

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Lixinc

USA . 11,438 parts In-Stock

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Argo Parts USA

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Continental Prestige Electronics

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Bastille Electronics

Australia . 10 parts In-Stock

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Technical Specifications

Power Management ICs BQ7791508PW attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

Battery over-voltage protection(Min/Max)(V) : 3 and 4.575

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

7.8 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

6

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.2 mm

Maximum Supply Current (Isup):

.08 mA

Maximum Supply Voltage (Vsup):

25 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

20 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4.4 mm

Trade Compliance

BQ7791508PW Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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